WMSIC Electronic Components

BHFUSE BSMD2920-200-24V BSMD2920

ModelBSMD2920-200-24V
Package2920
BrandBHFUSE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BHFUSE BSMD2920-200-24V
Type
BHFUSE
Minimum package
1500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BHFUSE
Electronic Component
BSMD2920-200-24V
Electronic Component
1
Electronic Component
5.44mm
Package
2920
Electronic Component
Resettable Fuse
Electronic Component
0.173g
Electronic Component
7.98mm
Electronic Component
1.4mm
Electronic Component
1
Electronic Component
4.5s
Electronic Component
BM0229474016
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
24V
Power(Pd)
1.8W

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSMD2920-200-24V 产品概述

一、产品简介

BSMD2920-200-24V 是佰宏(BHFUSE)推出的一款表面贴装可恢复自恢复保险(PTC resettable fuse),封装型号为 2920,适用于需要过流保护并具备自动复位能力的小型电子设备。器件在异常过流时跳闸限制电流,通过冷却可自动恢复,适合短路保护、过流保护与系统故障隔离。

二、主要技术参数

  • 品牌:BHFUSE(佰宏)
  • 型号:BSMD2920-200-24V(封装:2920)
  • 额定耐压:Vmax = 24 V
  • 保持电流:Ihold = 2 A(最大持续不触发电流)
  • 跳闸电流:Itrip = 4 A(器件进入高阻态的典型/门槛电流)
  • 最大允许电流:Imax = 40 A(瞬态/极限电流能力,按厂方说明使用)
  • 初始态阻值:Rmin = 20 mΩ(室温时的典型低阻态)
  • 跳断后阻值:R1max = 120 mΩ(进入高阻态后的最大残余阻抗)
  • 最大耗散功率:Pd = 1.8 W(在规定测试条件下)
  • 动作时间:4.5 s(从施加过流到进入高阻态的典型时间)
  • 工作温度:-40 ℃ ~ +85 ℃
  • 外形尺寸:长度 7.98 mm;宽度 5.44 mm;高度 1.4 mm

三、产品特性与优势

  • 小型 SMD 封装,便于自动化贴装与高密度 PCB 设计。
  • 明确的保持/跳闸电流区分(2 A 与 4 A),便于电路保护等级设定。
  • 跳闸后仍保持较低残余阻值(R1max 120 mΩ),减少对系统电压的剧烈影响。
  • 宽工作温度范围,适应工业级与民用环境。
  • 可恢复型保护,无需更换保险丝,降低维护成本与停机时间。

四、典型应用

  • USB、5V/12V/24V 分配电路过流保护
  • 电池管理系统(BMS)与便携设备保护
  • 工业控制板、通讯设备和消费电子的短路/过流防护
  • 电源模块输入侧保护及输出分路保护

五、设计与使用建议

  • 连续工作电流建议设计在 Ihold(2 A)以下,若系统会短时承受更高电流,应确认是否接受触发并自动复位。
  • PCB 布局:器件两端采用较宽的铜箔与多过孔散热,降低局部发热,保证器件温度稳定。
  • 热管理:在高环境温度或高功耗场景下遵循降额使用,必要时增加散热铜皮或热沉。
  • 测试与验证:在实际应用电压、环境温度与电路阻抗条件下验证动作时间与跳闸电流,确认系统行为满足安全要求。
  • 焊接工艺:按 SMD 贴装流程处理,遵循厂方建议的回流温度曲线(若无详细资料,请与供应商确认具体回流参数)。

六、可靠性与合规建议

  • 在高湿、高盐雾或腐蚀性环境使用前进行可靠性评估。
  • 对关键应用(汽车级、医疗类等)建议与供应商确认是否通过相应认可或有额外筛选件。
  • 建议在量产前进行寿命循环测试与热冲击测试,验证长时间反复跳闸后的性能稳定性。

七、封装与采购

  • 封装标注:2920;尺寸:7.98 × 5.44 × 1.4 mm(长 × 宽 × 高)。
  • 订购时请注明完整型号 BSMD2920-200-24V 及品牌 BHFUSE(佰宏),并向供应商索取最新数据手册与 PCB 推荐焊盘图,以保证设计与生产一致性。

如需完整的电阻-温度曲线、典型 I-t 曲线或参考电路图,请提供联系方式或索取佰宏的详细数据手册,我可以协助解释关键曲线与设计注意事项。

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