WMSIC Electronic Components

BHFUSE BSMD0603-020-16V BSMD0603

ModelBSMD0603-020-16V
Package0603
BrandBHFUSE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BHFUSE BSMD0603-020-16V
Type
BHFUSE
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BHFUSE
Electronic Component
BSMD0603-020-16V
Electronic Component
1
Electronic Component
1.05mm
Package
0603
Electronic Component
Resettable Fuse
Electronic Component
0.036g
Electronic Component
1.85mm
Electronic Component
1mm
Electronic Component
1
Electronic Component
600ms
Electronic Component
BM0227636330
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
16V
Power(Pd)
500mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSMD0603-020-16V 产品概述

一、产品定位与简介

BSMD0603-020-16V(BHFUSE/佰宏)是一款0603封装的自恢复式过流保护器件(PPTC),额定工作电压16V,保持电流Ihold为200mA。器件体积小、响应迅速、可自恢复,适合便携、通信及消费电子中低压电源和信号保护使用。

二、主要规格亮点

  • 尺寸(封装):0603,长×宽×高 = 1.85mm × 1.05mm × 1.00mm
  • 额定电压:Vmax = 16V
  • 保持电流:Ihold = 200mA(典型)
  • 跳闸电流:Itrip = 500mA(典型)
  • 初始态阻值:Rmin = 550mΩ
  • 跳断后阻值:R1max = 3.5Ω
  • 最大通过能力(瞬态/冲击参考):Imax = 40A
  • 动作时间:600ms(在标准测试条件下)
  • 功耗:Pd = 500mW
  • 工作温度范围:-40℃ ~ +85℃

三、功能与特性

  • 低阻抗:初始阻值仅约0.55Ω,减少常态下的功耗与电压降。
  • 可自恢复:过流触发后器件由高阻状态恢复到低阻,免去更换元件的需求,适合需重复保护的应用场景。
  • 小尺寸:0603封装利于高密度PCB布板,适合空间受限的消费类与便携设备。
  • 宽工作温度:-40℃~+85℃,适配工业级及消费类环境。

四、典型应用

  • USB/移动设备电源口、充电线路过流保护
  • IoT、可穿戴和移动终端的电源与电池管理
  • 摄像头、蓝牙耳机等小型电子模块输入保护
  • 信号线短路/过流防护(受限于电压和功率要求)

五、设计与选型建议

  • 保证正常工作电流远低于Ihold,建议常态电流≤0.7×Ihold以避免误跳闸。
  • 选择时注意Itrip与系统允许的最大故障电流配合,Itrip(500mA)应低于被保护线路可承受的损害阈值。
  • 16V为器件最大工作电压,超过该值会影响保护性能及可靠性。
  • Pd = 500mW 表明长期通过较高电流时器件会发热,布板时需考虑散热与周边热源影响。
  • 对于需通过较大浪涌或反复大电流脉冲的场合,请评估器件Imax(40A)与脉冲能量承受能力是否满足要求。

六、封装与焊接注意

  • 0603尺寸对贴装与回流工艺要求较高,建议采用常规无铅回流曲线并控制焊膏量与焊盘尺寸以确保焊接可靠性。
  • 高温回流可能影响PPTC的长期稳定性,生产过程中应遵循厂商给出的回流建议(如有)。

七、可靠性与测试

  • 建议在目标系统环境(温度、散热、耦合元件)下进行过流、热循环与寿命测试,验证实际Ihold/Itrip与动作时间是否满足设计要求。
  • 对关键产品做好样机全天候运行测试以观察自恢复次数与阻值漂移情况。

如需器件数据手册(datasheet)、回流曲线、推荐焊盘尺寸或样品测试报告,可联系供应商BHFUSE(佰宏)获取更详细的工程支持资料。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.