WMSIC Electronic Components

BHFUSE BSMD2920-300-33V BSMD2920

ModelBSMD2920-300-33V
Package2920
BrandBHFUSE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BHFUSE BSMD2920-300-33V
Type
BHFUSE
Minimum package
1500 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BHFUSE
Electronic Component
BSMD2920-300-33V
Electronic Component
1
Electronic Component
5.44mm
Package
2920
Electronic Component
Resettable Fuse
Electronic Component
0.173g
Electronic Component
7.98mm
Electronic Component
1.6mm
Electronic Component
1
Electronic Component
20s
Electronic Component
BM0227636332
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
33V
Power(Pd)
1.8W

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSMD2920-300-33V 产品概述

一、产品简介

BSMD2920-300-33V 是佰宏(BHFUSE)出品的一款表面贴装型PTC自恢复保险丝(型号:2920封装)。器件耐压最高33V,设计用于中低电压线路的过流和短路保护,结构紧凑(7.98mm × 5.44mm × 1.6mm),便于在空间受限的应用中实现可靠保护。

二、主要电气参数

  • 最高耐压(Vmax):33V
  • 最大允许电流(Imax):40A
  • 保持电流(Ihold):3A(常温下在规定条件下不动作)
  • 跳闸电流(Itrip):6A(在20秒动作测试条件下)
  • 功耗(Pd):1.8W(参考热功耗能力)
  • 初始电阻(Rmin):12mΩ
  • 跳断后最大电阻(R1max):48mΩ
  • 动作时间:20s(用于表征在标准测试条件下的动作点)
  • 工作温度范围:-40℃ ~ +85℃

三、产品特性与优势

  • 自恢复:在过流消除后可自动恢复导通,无需更换,降低维护成本。
  • 低初始阻值:12mΩ起,适合对压降敏感的电源路径,最大限度减少正常工作损耗。
  • 大电流承受能力:瞬态和容许电流高达40A,适合具有较大启动涌流或短时过载的场景。
  • 宽温度范围:适用于工业级环境和汽车电子等更苛刻温度条件(需结合实际工况校核)。

四、典型应用场景

  • 手机/平板/笔记本充电器及USB供电线路保护。
  • 电池管理和电池组支路保护(便携式电源、移动电源)。
  • 工业控制模块、通讯设备电源保护。
  • 马达驱动、继电器线圈和有大启动电流的负载保护。
  • 汽车电子辅助电路(需按汽车认证要求核实)。

五、选型与使用建议

  • 保持电流(Ihold)应高于系统最大正常工作电流,留有合适余量,以避免误动作。
  • 跳闸电流(Itrip)表示在规定时间会动作的阈值,需根据系统允许的过流持续时间选择合适型号。
  • 密切关注环境温度与器件功耗(Pd),高温或受限散热条件下应按厂家温升曲线进行电流降额。
  • 跳断后阻值上升(R1max 48mΩ)会导致电路在保护状态下仍有一定压降和发热,应考虑该特性在故障状态下的影响。
  • 若为汽车或关键安全系统,请确认是否需要通过AEC、UL等认证,并考虑增加冗余保护。

六、PCB安装与工艺要点

  • 按2920封装推荐焊盘设计布局,保证良好焊接和散热路径。
  • 遵循无铅回流焊工艺曲线,避免过热或过长时间的高温影响材料性能。
  • 贴装时避免在器件体上施加机械应力,储存时防潮防静电。
  • 在高电流应用中,可在器件附近加宽铜箔或增加过孔改善散热。

七、可靠性与检验

建议在样机阶段进行实际工况下的热测、长期循环测试以及短路耐受测试,验证Ihold/Itrip随温度漂移及重复动作后的稳定性。如有特殊认证需求,请在采购前与厂商确认相关测试报告与资质。

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