WMSIC Electronic Components

BHFUSE BSMD1812-050-33V BSMD1812

ModelBSMD1812-050-33V
Package1812
BrandBHFUSE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BHFUSE BSMD1812-050-33V
Type
BHFUSE
Minimum package
1500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BHFUSE
Electronic Component
BSMD1812-050-33V
Electronic Component
1
Package
1812
Electronic Component
Resettable Fuse
Electronic Component
0.099g
Electronic Component
1
Electronic Component
150ms
Electronic Component
BM0231068004
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
33V
Power(Pd)
1W
Current(Imax)
40A
Electronic Component
Electronic Component
Electronic Component
1500

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSMD1812-050-33V 产品概述

一、产品简介

BSMD1812-050-33V 是佰宏(BHFUSE)推出的一款 SMD 封装自恢复熔断器(PPTC),封装尺寸为 1812,专为直流系统过流保护设计。该器件工作电压上限 33V,适用于各种电源、通信和电子模块的二次过流保护,遇过载或短路自动限流并在故障消除后恢复正常。

二、主要性能参数

  • 最大工作电压(Vmax):33V
  • 允许最大电流(Imax):40A(瞬态承受能力)
  • 保持电流(Ihold):0.5A(在额定环境下持续不动作的电流)
  • 跳闸电流(Itrip):1A(在规定温度与条件下动作的典型值)
  • 动作时间:150ms(在规定过流条件下的响应时间)
  • 初始态阻值(Rmin):150mΩ
  • 跳断后阻值(R1max):1.4Ω
  • 最大功耗(Pd):1W
  • 工作温度范围:-40℃ ~ +85℃

三、产品特点

  • 小型 SMD(1812)封装,便于高速贴片生产与自动化装配。
  • 低初始电阻(150mΩ),对正常工作电路的压降影响小。
  • 快速动作(约 150ms),可在短时间内限制过流并保护下游器件。
  • 高瞬态承受能力(最高可达 40A),适合电源启动浪涌与短路冲击场景。
  • 自恢复特性,故障清除后无需更换即可恢复导通,便于维护与长期可靠运行。

四、典型应用场景

  • 通信设备与基站模块的输入保护
  • 电池管理与便携设备电源线路保护(电压 ≤33V)
  • 工业控制与仪器的局部过流保护
  • LED 驱动与照明系统的短路保护
  • USB、电源适配器与车载电子的小电流保护点

五、使用与选型建议

  • 持续工作电流应低于 Ihold(0.5A);建议留有裕量,实际设计中将连续电流控制在 70% 左右以提高可靠性。
  • 若存在长期环境高温或密集器件散热受限,应按更严格的 derating 考虑,以防止误动作。
  • 对于需要符合一级一次侧保护或需要单次熔断的场合,应结合熔断型保险或断路器使用;PPTC 主要作为二次和可恢复保护元件。
  • 注意器件的瞬态浪涌能力(Imax 40A)是短时承受值,不作为长期通过电流使用依据。

六、封装与安装注意事项

  • 采用标准 1812 尺寸焊盘布局,保证良好焊接强度与散热路径。
  • 在贴片回流焊过程中遵循厂商推荐的温度曲线,避免过高峰值温度或延长高温保持时间以免损伤聚合物结构。
  • 与热源保持一定距离,避免局部过热导致漂移或误动作。

七、测试与可靠性验证

  • 建议客户在目标系统中进行实际工况下的保持电流与跳闸测试,验证在不同环境温度下的动作时间与阻值变化。
  • 做长期循环试验以评估重复跳闸后的恢复阻值及性能漂移,参考 R1max(1.4Ω)评估跳断后对电路的影响。

八、包装与储存

  • 常用卷带或托盘包装,便于 SMT 生产线领用。
  • 存储时应避免高湿、强光与易燃化学物质的接触,推荐环境温度 0~40℃、相对湿度 <60%。

如需器件数据手册、封装尺寸图或回流焊曲线,可提供更详细的技术文档与应用支持,协助在目标系统中完成最佳选型与设计布局。

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