WMSIC Electronic Components

BHFUSE BSMD2920-300-30V BSMD2920

ModelBSMD2920-300-30V
Package2920
BrandBHFUSE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BHFUSE BSMD2920-300-30V
Type
BHFUSE
Minimum package
1500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BHFUSE
Electronic Component
BSMD2920-300-30V
Electronic Component
1
Electronic Component
5.44mm
Package
2920
Electronic Component
Resettable Fuse
Electronic Component
0.181g
Electronic Component
7.98mm
Electronic Component
1.6mm
Electronic Component
1
Electronic Component
20s
Electronic Component
BM0226603358
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
30V
Power(Pd)
1.8W

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSMD2920-300-30V 产品概述

一、产品简介

BSMD2920-300-30V 是佰宏(BHFUSE)推出的一款表面贴装型自恢复保护器件(PPTC/聚合物自恢复保险),封装规格为 2920。该器件主要用于直流电源及接口线路的过流保护,能够在短时过流或故障情况下快速增阻限流并在故障消除后自动恢复,适用于空间受限但要求较高电流通过能力的场合。

二、主要性能参数

  • 封装:2920(SMD)
  • 尺寸:长度 7.98 mm,宽度 5.44 mm,高度 1.6 mm
  • 初始态阻值(Rmin):12 mΩ(典型)
  • 跳断后阻值(R1max):48 mΩ(最大)
  • 保持电流(Ihold):3 A(持续不跳闸的最大电流)
  • 跳闸电流(Itrip):6 A(器件在规定条件下开始进入高阻态的电流)
  • 最大瞬时承受电流(Imax):40 A(短时浪涌耐受能力,非连续工作电流)
  • 耐压(Vmax):30 V DC
  • 最大耗散功率(Pd):1.8 W
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 动作时间:20 s(典型,指在特定过流条件下从常态到跳闸所需时间)
  • 品牌:BHFUSE(佰宏)

三、产品特点(要点)

  • 低初始电阻:12 mΩ 初始阻值,减小工作损耗,适合对压降敏感的供电线。
  • 可重复自恢复:过流保护触发后不需更换,故障清除后可自动恢复导通,便于维护。
  • 高浪涌承受能力:可短时间承受高达 40 A 的浪涌电流,适用于启动电流或短时冲击场合。
  • 紧凑封装:2920 SMD 体积小、厚度低,适合高密度 PCB 布局与自动贴装。
  • 宽温度适应性:-40 ℃ 至 +85 ℃ 的工作温度范围,满足工业级及车规近端应用的温度要求(需结合具体冷热循环验证)。

四、典型应用场景

  • USB、以太网等接口口的过流/短路保护。
  • 电池组与电源分配的前端保护。
  • 消费电子、笔记本电源与充电器的过流防护。
  • 汽车车载电子模块(需结合车规验证时考虑更严苛环境)。
  • DC-DC 转换器及功率管理模块输出端保护。

五、选型与使用建议

  • 电流余量:通常建议工作电流留有裕量,实际工作电流应小于 Ihold,避免长期临界工作导致发热和性能漂移。
  • 环境温度影响:PPTC 的 Ihold、Itrip 会随环境温度上升而下降,设计时按最高工作温度做必要的降额。
  • 耐压限制:本型号最大工作电压 30 V,应用时不得超过此值。
  • 浪涌场合:虽然 Imax 达 40 A,但该值为短时浪涌能力,不可作为连续额定电流使用;对频繁大浪涌场合需评估寿命影响。
  • 热设计:器件的功耗 Pd=1.8 W 为最大耗散能力,实际布局应保证散热通道和周边铜箔/基板热阻适配,避免器件过热。

六、焊接与封装注意事项

  • 建议采用推荐的 SMD 焊盘和回流工艺,避免过度加热导致材料性能退化(具体回流温度曲线请参照厂方工艺资料)。
  • 焊接后建议做外观和电气检测,确认阻值与无短路。
  • 存储与贴装时间窗应遵照潮湿敏感等级(MSL)相关规范,防止重流时吸湿炸裂。

七、可靠性与测试建议

  • 在最终产品中建议进行温升测试、长时老化(高温通电)测试与多次触发恢复循环测试,以验证器件在实际工作工况中的行为。
  • 对于关键应用,建议在温度极限条件下验证 Ihold/Itrip 的实际值,并记录在设计资料中。

八、包装与采购说明

  • 本型号为 BHFUSE(佰宏)标准产品,2920 SMD 封装支持自动贴装。采购时请向供应商确认批次资料、规格书和放样件以便完成可靠性验证。

备注:以上参数为该型号器件在标准测试条件下的典型/最大值说明,实际电气行为会受温度、PCB 散热、安装方式和测试条件影响。选型与最终应用设计前,建议参照厂方完整规格书并做应用场景下的验证测试。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.