WMSIC Electronic Components

BHFUSE BSMD0805L-150 BSMD0805L

ModelBSMD0805L-150
Package0805
BrandBHFUSE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BHFUSE BSMD0805L-150
Type
BHFUSE
Minimum package
4000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BHFUSE
Electronic Component
BSMD0805L-150
Electronic Component
1
Package
0805
Electronic Component
Resettable Fuse
Electronic Component
0.03g
Electronic Component
1
Electronic Component
5s
Electronic Component
BM0228072331
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
6V
Power(Pd)
1W
Current(Imax)
50A
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSMD0805L-150 产品概述

一、产品要点

BSMD0805L-150 是佰宏(BHFUSE)推出的一款 0805 封装自恢复聚合物保险丝(PTC Resettable Fuse),面向小型表贴电路的过流保护需求。主要参数如下:

  • 耐压(Vmax):6V
  • 最大电流(Imax):50A(短时浪涌能力,非持续工作电流)
  • 保持电流(Ihold):1.5A(在规定环境下可长期承载不跳闸的电流)
  • 跳闸电流(Itrip):3A(在规定时间内必然触发的电流)
  • 初始态阻值(Rmin):6mΩ
  • 跳断后阻值(R1max):55mΩ
  • 消耗功率(Pd):1W(用于热管理评估,应结合厂方试验条件理解)
  • 工作温度:-40℃ ~ +85℃
  • 封装:0805 SMD

二、主要电气与热性能说明

  • 保持电流(Ihold)是器件在标准温度下能够长期承载而不进入高阻态的最大电流;选择时应保证正常工作电流远低于 Ihold,并留有余量以应对工况变化。
  • 跳闸电流(Itrip)是使器件在一定时间内进入高阻态以限制电流的最小值;实际触发时间随电流幅值、环境温度和散热条件变化。
  • 初始阻值 Rmin 低(6mΩ)能确保正常导通时电压降和功耗较小;跳断后阻值上升至最大约 55mΩ,从而有效限制过流。
  • Pd = 1W 表示在特定工况下的热功耗参考值,用于评估局部温升与 PCB 布局的散热需求。实际热性能受封装、铜箔面积和环境温度影响明显。

三、封装与机械信息

  • 0805 小型表贴封装,适配常见 SMT 工艺,节省 PCB 空间。
  • 物理尺寸使其适合便携设备、消费电子和紧凑电源模块,但对焊接热稳定性和应力敏感,建议遵循厂方的回流焊工艺规范。

四、典型应用场景

  • 移动电源、便携式设备的输入短路与过流保护。
  • USB、音频、摄像头等低压接口的保护(注意总线电压需 <=6V)。
  • 含高启动电流但短时存在的电路(如马达、背光灯)可配合限流器或 inrush current 控制策略使用。
  • 电池保护电路中的短路防护(需与电池管理系统配合设计)。

五、选型与使用建议

  • 选型原则:将正常工作电流保持在 Ihold 的 50%~80% 以下,重要或长期工作场景建议更低的去衰减裕量。
  • 对于频繁出现的瞬态浪涌,应关注 Imax 和器件的自愈循环寿命;短时浪涌能量和次数均应在数据手册允许范围内。
  • PCB 布局:增大周围铜箔面积、远离热源以利散热,避免器件长期处于高温环境导致电特性漂移。
  • 测试验证:在目标系统中进行实际的过流、热循环和寿命测试,记录触发电流与恢复时间,以确认设计裕量。

六、可靠性与检验要点

  • 在不同环境温度下重复测量 Ihold 与 Itrip,评估热漂移影响。
  • 做多次跳闸恢复循环测试,观察 R1max 与恢复时间的变化,确认长期稳定性。
  • 生产引入检验:尺寸与阻值抽测、焊接后阻值与功能测试、外观检查。

总结:BSMD0805L-150 以其 0805 紧凑封装、低初始阻值和明确的保持/跳闸电流,适合低压小尺寸电路的过流保护。为达到可靠保护效果,选型与 PCB 布局必须综合考虑正常工作电流、冲击电流、环境温度与散热条件,并按厂方 Datasheet 与验证试验结果调整最终设计。

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