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BHFUSE BSMD1812-050-30V BSMD1812
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BHFUSE BSMD1812-050-30V
- Type
- BHFUSE
- Minimum package
- 1500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- BHFUSE
- Electronic Component
- BSMD1812-050-30V
- Electronic Component
- 1
- Package
- 1812
- Electronic Component
- Resettable Fuse
- Electronic Component
- 0.095g
- Electronic Component
- 1
- Electronic Component
- 150ms
- Electronic Component
- BM0226603797
- Operating Temperature
- 40℃~+85℃
- Voltage Rating(Vmax)
- 30V
- Power(Pd)
- 800mW
- Current(Imax)
- 40A
- Electronic Component
- Electronic Component
- Electronic Component
- 1500
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BSMD1812-050-30V 自恢复保险丝（BSMD1812-050-30V 1812）产品概述
一、产品简介
BSMD1812-050-30V 为佰宏（BHFUSE）推出的一款1812封装自恢复聚合物过流保护元件（PPTC）。器件在过流时会迅速增阻限流，故障消除后可自动冷却恢复低阻态，适用于USB、电源管理、消费电子与工业控制等需重复过流保护的线路。
二、主要电气参数
- 跳断后阻值 (R1max)：1.4 Ω（到达跳闸状态时的最大阻抗）
- 初始态阻值 (Rmin)：150 mΩ（冷态低阻，保证正常供电损耗低）
- 耐压 (Vmax)：30 V（器件允许的最大直流工作电压）
- 跳闸电流 (Itrip)：1 A（使器件进入高阻态的典型触发电流）
- 保持电流 (Ihold)：500 mA（器件能在不触发下持续通过的最大电流）
- 最大电流 (Imax)：40 A（材料或测试的峰值承受能力，通常为短时瞬态条件）
- 动作时间：150 ms（从过流到进入高阻态的典型响应时间）
- 消耗功率 (Pd)：800 mW（在规定工况下的最大稳态功耗）
- 工作温度：-40 ℃ ~ +85 ℃
三、结构与封装说明
器件为SMD 1812规格，适配常见贴片工艺。封装紧凑，便于自动贴装与回流焊工艺集成。热阻与周边铜箔面积、PCB散热设计相关，实际热响应受周边布线和环境影响较大。
四、典型应用场景
- USB、HDMI等接口的短路与过流保护
- 电源输入与DC-DC模块的线路保护
- 家电与工业控制板卡的复位型过流防护
- 电池保护与充电管理系统（配合限流策略）
五、使用与布局建议
- 连续工作电流建议不超过保持电流(Ihold)=500 mA，以避免长期发热与误触发。
- 对有大幅度浪涌电流的场合，结合延时或限流电路评估，考虑器件响应时间(150 ms)。短脉冲可能不触发，但频繁脉冲会导致热累积。
- PCB布局应留有足够散热铜面，器件附近避免高温元件，焊盘尺寸按1812封装规范设计并保证良好铜量。
- 对于关键电源路径，建议做实际温升与循环试验，验证在目标环境下的可靠性。
六、可靠性与测试要点
- 建议进行浪涌、热循环和多次触发恢复测试，以确认在目标应用中的重复触发寿命与阻值漂移。
- 评估断后（高阻态）电压降与系统容忍度，确认在跳闸状态下不会影响被保护电路安全。
七、选型提示与替代考虑
- 若系统工作电流接近或超过Ihold，应选用额定保持电流更高的型号；若工作电压超过30 V，须改用更高耐压产品。
- 最大电流（Imax=40 A）多用于短时冲击场景，不应作为连续使用依据。选型时以Ihold和Itrip为主要参考，并综合考虑动作时间与功耗限制。
如需进一步的典型曲线（I–T、I–R、温升曲线）、封装尺寸图或可替代型号建议，可提供具体应用工况，我会给出更精确的选型与布局方案。
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