WMSIC Electronic Components

BHFUSE BSMD1812-260-30V BSMD1812

ModelBSMD1812-260-30V
Package1812
BrandBHFUSE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BHFUSE BSMD1812-260-30V
Type
BHFUSE
Minimum package
1500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BHFUSE
Electronic Component
BSMD1812-260-30V
Electronic Component
1
Package
1812
Electronic Component
Resettable Fuse
Electronic Component
0.114g
Electronic Component
1
Electronic Component
8s
Electronic Component
BM0231068008
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
30V
Power(Pd)
1.2W
Current(Imax)
40A
Electronic Component
Electronic Component
Electronic Component
1500

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSMD1812-260-30V 产品概述

一、产品概况

BSMD1812-260-30V 是佰宏(BHFUSE)面向表面贴装过流保护的自恢复保护元件(Polymeric PTC / 可复位保险元件)系列中的标准型号,封装尺寸为 1812,适用于 30V 额定耐压的低压电源与信号线路保护场景。该型号“260”代表典型保持电流为 2.6A,兼顾日常工作电流与故障时可靠触发保护的需求,适合消费电子、通信、电源模块和工业终端等多种应用。

主要电气参数(概要)

  • 耐压(Vmax):30V
  • 最大冲击/允许短时电流(Imax):40A
  • 保持电流(Ihold):2.6A
  • 跳闸电流(Itrip):5.2A
  • 功耗(Pd,稳态功耗):1.2W
  • 初始态阻值(Rmin):10mΩ
  • 跳断后最大阻值(R1max):70mΩ
  • 动作时间(在指定过流条件下):8s
  • 工作温度:-40℃ ~ +85℃
  • 封装:1812(SMD)

二、主要特性与优点

  • 精准的热触发保护:在电路发生过流(超过 Itrip)并持续一定时间时,PTC 材料迅速升温至高电阻态,限制电流,保护下游元件与电源线路。
  • 可复位设计:故障解除并冷却后,元件阻值会恢复到低阻态,可重复使用,便于维护与长期可靠性。
  • 低初始阻值:Rmin 为 10mΩ,保证在正常工作电流下压降小、能效高。
  • 高幅值冲击能力:Imax 40A 能承受较大短时浪涌电流(如电容器充电、瞬态冲击等),不易误触发。
  • 宽温度工作范围:-40℃ 至 +85℃,适用于环境温度变化较大的应用场景。
  • 1812 SMD 封装:适配自动化贴装与回流焊工艺,方便批量生产与小型化设计。

三、典型应用场景

  • 移动电源、充电器与USB供电线路过流保护;
  • 带电机或高电流负载的保护电路(作为一级保护或配合熔断器使用);
  • 通信设备及基站供电模块输入保护;
  • 工业控制器、检测仪表中敏感电路的浪涌限流;
  • 电池系统中的短路/浪涌保护(需配合电池管理策略共同设计)。

四、设计与选型建议

  • 留有裕量:在选择时建议把实际工作电流与 Ihold 做适当区分(通常保留 20%-50% 余量),以避免长期高压降导致元件发热或漂移。
  • 温度影响:PTC 的保持电流与动作特性会随环境温度变化而改变;在高温环境下容易提前触发,应考虑下调允许通过的持续电流或选择更大等级器件。
  • 冷却与散热:尽量在 PCB 布局中为器件提供良好热散路径(扩大焊盘、连接接地铜箔或散热铜皮),以降低局部温升,保证重复动作的一致性。
  • 瞬态冲击考虑:Imax=40A 表示对短时浪涌具备一定承受力,但仍建议配合 TVS、限流电阻或软启动电路以控制重复冲击对器件寿命的影响。
  • 与熔断器配合:在要求更快断开或需要完全隔离的场景,可把 BSMD1812 用作二次保护器件,一级采用普通熔断器或高分断元件。

五、封装与焊接注意事项

  • 采用 1812 SMD 标准封装,建议遵循厂方推荐的 PCB 焊盘尺寸与回流焊曲线。避免长时间在高温下暴露,以免影响材料特性。
  • 回流焊后建议进行 24~48 小时的自然恢复,以保证器件回到稳定低阻态后再上电测试。
  • 避免在器件表面施加机械应力,贴装时注意夹持位置与压力分布。

六、可靠性与维护

  • 可重复循环:BSMD1812 系列设计用于多次热触发与冷却恢复,正常使用条件下具备较高循环寿命,但频繁的高次触发会加速老化。
  • 阻值漂移:经过多次触发或长期高温工作,Rmin 与 R1max 可能出现轻微漂移,设计时需留出容差。
  • 存储与保养:避免潮湿、高温及化学腐蚀性环境存放;长期库存前建议遵循干燥箱或密封包装保存准则。

七、对比与注意事项

  • 与一次性熔断器相比,BSMD1812 可复位、降低维护成本,但在需要完全断路或快速断开的场合仍需使用熔断器或继电器。
  • 对于对压降极其敏感的高精度电源,需优先评估器件在正常工作下的压降影响(由 Rmin 与工作电流决定)。

总结:BSMD1812-260-30V 以其 2.6A 的保持电流、可复位保护特性、低初始阻值与 30V 的额定电压,适合大多数中低电压直流系统的过流与瞬态保护需求。正确的选型、良好的 PCB 散热与合适的电路配套,可确保其在产品中长期稳定工作。若需进一步的回流焊曲线、热特性曲线或典型 I–T 曲线,请参考佰宏官方 datasheet 或联系技术支持获取详尽数据。

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