WMSIC Electronic Components

BHFUSE BSMD2018-075-60V BSMD2018

ModelBSMD2018-075-60V
Package2018
BrandBHFUSE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BHFUSE BSMD2018-075-60V
Type
BHFUSE
Minimum package
1500 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BHFUSE
Electronic Component
BSMD2018-075-60V
Electronic Component
1
Electronic Component
4.93mm
Package
2018
Electronic Component
Resettable Fuse
Electronic Component
0.139g
Electronic Component
5.44mm
Electronic Component
1.2mm
Electronic Component
1
Electronic Component
300ms
Electronic Component
BM0228072342
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
60V
Power(Pd)
1.2W

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSMD2018-075-60V 产品概述

一、产品简介

BSMD2018-075-60V(BHFUSE/佰宏)是一款表面贴装自恢复式过流保护元件(聚合物PTC自恢复保险丝),封装类型为2018,适用于最大工作电压60V的电子电路保护。器件在正常工作时保持低电阻,发生过流或短路时迅速升温增阻,从而限制电流并保护下游电路,故障消除后可自动恢复。

二、主要技术参数

  • 工作温度范围:-40℃ ~ +85℃
  • 额定保持电流(Ihold):750 mA
  • 跳闸电流(Itrip):1.5 A
  • 最大持续电流(Imax):10 A(冲击承受能力)
  • 初始态阻值(Rmin):110 mΩ
  • 跳断后阻值(R1max):630 mΩ
  • 最大耐压(Vmax):60 V
  • 最大功耗(Pd):1.2 W
  • 动作时间:≤300 ms
  • 尺寸:长度 5.44 mm × 宽度 4.93 mm × 高度 1.2 mm(SMD 2018 类似封装)

备注:器件标称电流参数通常在环境温度+23℃下测得,环境升温会降低动作电流和保持能力,应在实际应用中考虑温度漂移。

三、产品特点与优势

  • 体积小、贴片工艺兼容,适合自动化组装;
  • 低初始电阻(约110 mΩ),对电路影响小;
  • 快速响应(≤300 ms),可在短路或持续过流时有效限流保护;
  • 自恢复能力强,故障消除后无需更换;
  • 60V 耐压覆盖常见12/24/48V等系统电压应用。

四、典型应用场景

  • USB/通信设备电源保护;
  • 工业控制与自动化电源总线;
  • 电池管理与便携设备电源保护(需配合电池保护电路使用);
  • 汽车电子(非关键安全回路,需评估温度及浪涌条件);
  • 医疗、楼宇及安防设备的输入电源防护。

五、选型与设计建议

  • 确定Ihold应大于正常工作最大电流并留有裕量,避免误动作;
  • Itrip应低于电路能承受的短路极限,确保在故障时能及时限制电流;
  • 考虑环境温度对Ihold/Itrip的影响,必要时选择额定更高型号或并联使用;
  • 布局时保证周边有一定散热空间,避免长期热累积影响恢复性能;
  • 推荐按厂商推荐的贴片焊盘和回流曲线进行 PCB 设计和工艺控制。

如需完整数据手册、典型应用电路或PCB封装图,请告知,我可以提供更详细的资料和选型建议。

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