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BHFUSE BSMD1206C-1150T BSMD1206C
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BHFUSE BSMD1206C-1150T
- Type
- BHFUSE
- Minimum package
- 3000 编带
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- BHFUSE
- Electronic Component
- BSMD1206C-1150T
- Electronic Component
- 1
- Electronic Component
- 1.6mm
- Package
- 1206
- Type
- SMD Fuse
- Electronic Component
- Non-Resettable Fuse
- Electronic Component
- 0.03g
- Electronic Component
- 3.2mm
- Electronic Component
- 0.6mm
- I2t
- 0.17
- Electronic Component
- 1
- Electronic Component
- 50A
- Electronic Component
- BM0264819710
- Operating Temperature
- 55℃~+150℃
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BSMD1206C-1150T 产品概述
一、产品简介
BSMD1206C-1150T 为佰宏（BHFUSE）出品的贴片式时间滞后（慢熔）保险丝，采用1206封装（3.2 × 1.6 × 0.6 mm）。产品设计用于在允许短时浪涌电流的同时，对持续过流提供可靠保护，适配现代小型化电源与电子模块防护需求。
二、主要参数
- 类型：贴片式时间滞后保险丝（SMD slow-blow）
- 额定电流：1.5 A
- 额定电压：72 V
- 工作温度范围：-55 ℃ ~ +150 ℃
- 熔断能量（I2t）：0.17 A²s（典型）
- 分断能力：50 A
- 外形尺寸：长度 3.2 mm、宽度 1.6 mm、高度 0.6 mm
- 封装：1206（SMD）
- 无铅设计，兼顾高温与机械冲击耐受性
三、主要特性与优势
- 时间滞后特性：允许启动或瞬态浪涌电流通过而不致误熔，适合带电容器或电机等高启动电流的负载。
- 高分断能力：最高50 A 的分断能力，能在短路条件下迅速开断，减少对电路的二次损害。
- 宽温工作范围：-55 ℃ 至 +150 ℃，适用于高温工况与严苛环境。
- 无铅工艺：焊接与温循环性能优异，更耐热和抗冲击，符合现代制造要求。
- 小型化封装：1206体积适合空间受限的PCB布局，实现高密度装配。
四、典型应用场景
- 开关电源输入与输出保护
- 通信设备与路由器电源防护
- 工业控制模块与仪器的过流保护
- 电动车充电/辅助电路（72 V 及以下）
- 家用电器与LED驱动器中需要抗浪涌的保护点
五、可靠性与性能说明
BSMD1206C-1150T 在热循环、振动和冲击条件下保持稳定的开断特性与寿命。I2t 值低，表示在短路故障时的让渡能量可控，有助于保护下游元件。无铅结构在反复温度循环下表现出更佳的机械完整性与接触可靠性。
六、封装与焊接建议
- 建议按厂商推荐的1206 SMD 焊盘布局设计，保证焊接牢固且热量分布均匀。
- 采用标准无铅回流工艺时，请参考器件承受的温度上限与回流曲线，避免过度焊接热应力。
- 对于高功率或需散热的应用，应在PCB设计中预留适当铜箔以利散热并防止局部过热。
七、选型与订购提示
在选型时，确认系统最大工作电压不超过72 V，启动浪涌电流与持续负载与器件额定值匹配。如需更高分断能力或不同响应特性，可咨询佰宏提供其它系列型号与数据表支持。型号示例：BSMD1206C-1150T（1.5 A，1206 封装）。
如需完整电气特性曲线、时-电特性（时间-电流曲线）或样片测试报告，建议联系厂商获取详细数据手册。
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