WMSIC Electronic Components

BHFUSE BSMD1812-075-24V BSMD1812

ModelBSMD1812-075-24V
Package1812
BrandBHFUSE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BHFUSE BSMD1812-075-24V
Type
BHFUSE
Minimum package
1500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BHFUSE
Electronic Component
BSMD1812-075-24V
Electronic Component
1
Electronic Component
3.41mm
Package
1812
Electronic Component
Resettable Fuse
Electronic Component
0.1g
Electronic Component
4.73mm
Electronic Component
1.1mm
Electronic Component
1
Electronic Component
200ms
Electronic Component
BM0229474026
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
24V
Power(Pd)
800mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSMD1812-075-24V 自恢复保险丝(BHFUSE 佰宏)产品概述

一、产品概述

BSMD1812-075-24V 是佰宏(BHFUSE)推出的一款面向印制板安装的自恢复保险丝(PPTC),采用1812 SMD封装,适用于最高工作电压24V的低压电源保护场合。器件在过流时自动限流并在故障排除后恢复低阻状态,适合对重复过流事件需自动复位的系统。

二、主要参数

  • 耐压(Vmax):24 V
  • 最大承受电流(Imax):40 A(短时浪涌能力)
  • 保持电流(Ihold):0.75 A(不会触发的最大稳态电流)
  • 跳闸电流(Itrip):1.5 A(典型触发电流)
  • 消耗功率(Pd):0.8 W
  • 初始阻值(Rmin):90 mΩ
  • 跳断后阻值(R1max):450 mΩ
  • 动作时间:约 200 ms(在规定过流条件下)
  • 工作温度范围:-40 ℃ 至 +85 ℃
  • 尺寸(L×W×H):4.73 × 3.41 × 1.10 mm(1812封装)

三、工作原理与典型性能

  • 正常工作时,器件阻值低(约90 mΩ),对电路影响小;当电流超过Itrip时,内阻快速上升,限制电流并消耗过剩能量,从而保护后端器件。
  • 跳闸后器件阻值可上升至最多450 mΩ,显著减小流过电流;故障清除并在合适冷却时间后,器件逐步恢复原始低阻状态,实现自动复位。
  • Imax 表示器件可承受的短时冲击电流能力,应避免长期在此值附近工作。

四、典型应用场景

  • 汽车电子(24V 辅助电路、车载模块保护)
  • 工业控制及通信设备的电源入口保护
  • 电池管理、充电器、DC-DC变换器的短路/过流防护(在24V及以下系统)
  • USB/外围模块电源保护(需注意电压与电流匹配)

五、选型与使用注意事项

  • 额定保持电流(Ihold)应大于正常工作最大连续电流,建议留至少20–50%裕量以防误触发。
  • 跳闸电流(Itrip)确定保护阈值;若系统需要更快动作或更严格限流,应考虑更低Itrip或并联/级联保护方案。
  • 环境温度对触发行为影响显著:温度越高,器件越容易触发;高温环境需适当提高Ihold裕量或进行温度去耦设计。
  • 若电路会承受频繁短时浪涌(接通瞬间、电机启动等),请核对Imax及浪涌寿命或在前端增加浪涌抑制器件(如NTC或TVS)。

六、封装与焊接建议

  • 1812 SMD 封装,建议按厂家推荐的回流焊温度曲线进行焊接,避免超时高温以免影响内部聚合物材料特性。
  • 设计PCB焊盘时考虑热量散布与机械固定,避免在器件上方进行重压或过度弯曲。
  • 焊接后建议进行功能性试验以确认初始阻值和基本行为。

七、可靠性与测试建议

  • 通过循环跳闸测试评估器件在目标应用下的寿命(多次过流-冷却循环)。
  • 在预期工作温度范围内验证Ihold/Itrip变化曲线并进行温度系数评估。
  • 对于关键应用,建议结合短路持续时间分析,必要时做热仿真或实测以确认PCB与周围元件的热影响。

本器件适合对低压直流系统提供可重复自动复位的过流保护。选型时以实际工作电流、环境温度、浪涌特性和安全裕度为主,按以上建议布局与测试可获得更稳定的保护效果。若需更详细的电气曲线和回流焊规范,建议索取厂方完整数据手册。

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