WMSIC Electronic Components

BHFUSE BSMD0603L-100 BSMD0603L

ModelBSMD0603L-100
Package0603
BrandBHFUSE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BHFUSE BSMD0603L-100
Type
BHFUSE
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BHFUSE
Electronic Component
BSMD0603L-100
Electronic Component
1
Package
0603
Electronic Component
Resettable Fuse
Electronic Component
0.034g
Electronic Component
1
Electronic Component
500ms
Electronic Component
BM0226534893
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
6V
Power(Pd)
1W
Current(Imax)
50A
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSMD0603L-100 自恢复保险丝 产品概述

一、产品简介

BSMD0603L-100 是佰宏(BHFUSE)推出的一款 0603 封装自恢复保险丝(PPTC),用于对电路短路或过流故障提供自动保护并在故障消除后恢复导通。该器件体积小、响应适中,适合空间受限的消费类和工业电子产品中作为过流保护元件。

二、主要特性

  • 初始低阻抗:典型初始态阻值 Rmin = 9 mΩ,减少正常工作下的功率损耗和电压降。
  • 跳断后阻值:R1max = 80 mΩ,进入限流状态后有效限制故障电流。
  • 低压工作:耐压 Vmax = 6 V,适配低压电源总线。
  • 自恢复能力:在过流或短路解除后可自动恢复到低阻状态,免去更换费用。
  • 宽工作温度:-40 ℃ 至 +85 ℃,满足多数室内与部分工业环境要求。

三、电气与热学参数

  • 保持电流 Ihold = 1 A:表示在规定环境下器件可持续承载而不会触发跳闸。
  • 跳闸电流 Itrip = 2 A:当电流超过此值时,器件将在动作时间内进入高阻限流态。
  • 最大电流 Imax = 50 A:短时间可承受的浪涌或冲击电流能力(注意与动作时间、热能相关)。
  • 消耗功率 Pd = 1 W:器件在高阻或持续加热状态下的额定功耗限制。
  • 动作时间 ≈ 500 ms:从触发到进入限流状态的典型响应时间,依环境温度和电流幅值会有变化。

四、典型应用

  • 移动设备、蓝牙耳机、便携式仪器的电源线与电池保护;
  • IoT 模组、电源管理板、USB/TYPE-C 子系统的过流防护;
  • 家电与工业控制板中对局部电路的短路保护。

五、选型建议与注意事项

  • 确认系统最大工作电压不超过 6 V;若存在高电压回路需选更高耐压器件。
  • 保持电流 Ihold 与电路常态工作电流充分裕量,避免因正常浪涌或启动电流误动作;若常态电流接近或超过 1 A,应选择额定更高 Ihold 型号。
  • 留意环境温度对动作特性影响:高温降低触发电流,低温则相反,应结合工作温度曲线评估。
  • 对于频繁或长期处于限流状态的场景,应评估热耗与可靠性,避免长期在高阻态下运行。

六、封装与焊接建议

  • 封装 0603,适合自动贴片工艺。推荐遵循厂家给出的回流焊温度曲线和板上焊盘设计,以保证热循环可靠性与电气性能。
  • 注意避免在大功率浪涌试验中造成局部过热导致永久性能下降。

七、存储与可靠性

  • 建议干燥、常温环境下存放,避免潮湿高温,防止封装和内部材料老化。
  • 在设计与测试阶段应进行短路、温升与多次触发恢复试验,以验证在目标应用中的长期稳定性。

总结:BSMD0603L-100 以其小体积、自动复位与适合低压系统的电气特性,适用于对空间和成本敏感的过流保护场景。选型时应重点考虑 Ihold 与 Itrip 相对电路工作电流的匹配以及环境温度对性能的影响。若需详细的热—电特性曲线或回流焊工艺参数,可向 BHFUSE 索取完整规格书以做更精确的设计验证。

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