WMSIC Electronic Components

BHFUSE BSMD2410C-2250T BSMD2410C

ModelBSMD2410C-2250T
Package2410
BrandBHFUSE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BHFUSE BSMD2410C-2250T
Type
BHFUSE
Minimum package
1500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BHFUSE
Electronic Component
BSMD2410C-2250T
Electronic Component
1
Electronic Component
2.6mm
Package
2410
Type
SMD Fuse
Electronic Component
Non-Resettable Fuse
Electronic Component
0.196g
Electronic Component
6.1mm
Electronic Component
2.6mm
I2t
1187
Electronic Component
1
Electronic Component
100A@350VAC
Electronic Component
BM0264819704
Operating Temperature
55℃~+125℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSMD2410C-2250T 产品概述

一、产品简介

BSMD2410C-2250T 是佰宏(BHFUSE)出品的一款贴片式(SMD)保险丝,封装规格为 2410(尺寸 6.1mm × 2.6mm × 2.6mm)。该器件额定电流为 25A,额定电压 350V,工作温度范围宽(-55℃ ~ +125℃),并取得 UL 认证,适用于对过流保护和短路清断能力有较高要求的电源及工业应用。

二、主要电气与热特性

  • 额定电流:25A
  • 额定电压:350V
  • 熔断能量(I2t):1187(典型,单位 A²s)
  • 分断能力:100A @ 350VAC(表示在最多 100A 的短路电流下可可靠断开)
  • 工作温度:-55℃ ~ +125℃
    这些参数表明该型号在高电压、高电流工况下具有良好的保护能力与热稳定性,能在严苛环境下提供可靠动作。

三、结构与尺寸

该器件为贴片结构,封装尺寸符合 2410 标准:长 6.1mm、宽 2.6mm、高 2.6mm。适配标准 SMD 生产工艺,便于回流焊贴装与自动化生产。外壳与端接设计兼顾导热与焊接可靠性。

四、产品优势

  1. 高分断能力:100A@350VAC,能在较大短路电流下完成断开,降低对后端电路的二次损害。
  2. 宽温度范围与高可靠性:适应工业级温度变化,适合长寿命工作场景。
  3. 封装小型化:2410 贴片封装,便于在空间受限的电源或模块内布局。
  4. UL 认证:满足安全认证要求,便于整机认证与市场准入。

五、典型应用

  • 工业电源与逆变器的输入保护
  • 交流/直流电源模块、PFC 单元与电池充放电保护
  • 通信、电信供电与基站设备
  • 家用大功率电器与电源适配器
  • 其他需要 350V 级别过流保护的高压电路

六、使用建议与注意事项

  • 额定电流为长期通过能力的参考值,建议根据工作温度和散热条件进行降额使用,避免在高温环境下长期以额定值运行。
  • 选型时需结合实际负载起动浪涌电流与允许熔断时间(I2t)考虑,必要时在输入侧加入限流元件或延时保护。
  • PCB 设计时预留合适的焊盘尺寸与热沉区域以保证散热及可靠焊接,推荐按厂商提供的封装与焊盘图纸设计。
  • 回流焊工艺需遵循焊接温度曲线,避免过度热应力导致性能退化。

七、存储与可靠性

建议在干燥、防潮、常温条件下存放,避免强光与腐蚀性气体。长期库存前应按生产商要求进行封装状态保存(如防潮包装),以确保焊接可靠性与电气特性稳定。

八、采购与认证信息

品牌:BHFUSE(佰宏)
型号:BSMD2410C-2250T
封装:2410(贴片)
认证:UL 认证(具体证书编号请向供应商索取)
在采购前建议与供应商确认样片测试、放大样加工以及是否提供完整数据手册与可靠性报告,以便在整机设计与认证过程中顺利对接。

以上为 BSMD2410C-2250T 的产品概述与应用建议,如需更详细的 I-V 曲线、时间-电流特性或封装图纸,可提供具体需求,我将帮助检索或分析。

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