WMSIC Electronic Components

BHFUSE BSMD1812-030-30V BSMD1812

ModelBSMD1812-030-30V
Package1812
BrandBHFUSE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BHFUSE BSMD1812-030-30V
Type
BHFUSE
Minimum package
1500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BHFUSE
Electronic Component
BSMD1812-030-30V
Electronic Component
1
Package
1812
Electronic Component
Resettable Fuse
Electronic Component
0.114g
Electronic Component
1
Electronic Component
100ms
Electronic Component
BM0229474033
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
30V
Power(Pd)
800mW
Current(Imax)
40A
Electronic Component
Electronic Component
Electronic Component
1500

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSMD1812-030-30V(BHFUSE 佰宏)产品概述

一、产品概况

BSMD1812-030-30V 是佰宏(BHFUSE)推出的一款 1812 封装表面贴装自恢复保险元件(PTC resettable fuse),用于电路过流保护和短路限流。该器件在正常工作时阻值低、功耗小;当电流超过设定阈值时迅速升温增阻,实现限流保护;故障排除后可自动冷却复位,便于重复使用,适合消费电子、通讯、计算设备与工业控制等场景。

二、主要技术参数

  • 品牌:BHFUSE(佰宏)
  • 封装:1812(SMD)
  • 初始态阻值(Rmin):0.25 Ω
  • 跳闸电流(Itrip):600 mA
  • 保持电流(Ihold):300 mA
  • 跳断后阻值(R1max):3 Ω(最大)
  • 最大电流(Imax):40 A
  • 耐压(Vmax):30 V
  • 消耗功率(Pd):800 mW
  • 动作时间:100 ms(在标称条件下)
  • 工作温度范围:-40 ℃ ~ +85 ℃

三、产品特点与优势

  • 响应迅速:100 ms 量级动作时间,可在短时间内限制故障电流,保护下游元件。
  • 低初始阻值:0.25 Ω 起,典型情况下对供电路径影响小,适合对压降敏感的线路。
  • 可复位:故障解除后自动恢复,降低维护成本并简化设计。
  • 宽电流范围:Ihold/ Itrip 设定适用于低功耗信号与接口电源保护,Imax 达 40 A,能承受短时冲击电流。
  • 紧凑封装:1812 SMD 适合自动贴装与密集布局。

四、典型应用

  • USB、HDMI 等接口过流保护
  • 通信设备与路由器的供电保护
  • 电源模块输入侧的浪涌/短路防护
  • 电池管理与便携设备充电线路
  • 工业控制板与测量仪器的局部保护

五、选型与使用建议

  • 正常工作电流应低于 Ihold,且在最大可能瞬态下仍低于 Itrip;若系统存在较大浪涌或启动电流,应考虑并联限流电阻或选择更高规格元件。
  • 耐压 30 V,适用于低压直流系统;高压系统需选用更高耐压器件或并联设计。
  • 关注热环境:长期高温会影响动作特性与复位速度,请在设计时留有热裕量并避免热源邻近。
  • 对于需要快速复位或频繁动作的场合,评估恢复时间与寿命,必要时采用外部熔断或断路器作为补充保护。

六、封装与焊接注意事项

  • 本品为 1812 SMD,支持常规回流焊工艺。建议遵循元件制造商与 PCB 组装商的回流曲线与峰值温度限制,避免过长高温暴露以免影响可靠性。
  • 储存与拆卸时避免潮气和机械应力,必要时按潮湿敏感元件(MSL)规范处理。

七、可靠性与品质建议

  • 建议在原厂或正规渠道采购,关注批次一致性与质量报告。
  • 对关键应用进行温度循环、过流寿命测试与实际系统验证,确保在目标工况下动作与复位特性满足需求。

如需针对具体电路(例如 USB 5 V 输入、步进电机驱动器或电池充电路径)进行选型比对和仿真建议,我可以根据系统工作电流、浪涌特性与热环境提供更具体的配置与替代型号建议。

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