WMSIC Electronic Components

BHFUSE BSMD0603-020-12V BSMD0603

ModelBSMD0603-020-12V
Package0603
BrandBHFUSE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BHFUSE BSMD0603-020-12V
Type
BHFUSE
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BHFUSE
Electronic Component
BSMD0603-020-12V
Electronic Component
1
Electronic Component
1.05mm
Package
0603
Electronic Component
Resettable Fuse
Electronic Component
0.032g
Electronic Component
1.85mm
Electronic Component
1mm
Electronic Component
1
Electronic Component
600ms
Electronic Component
BM0229474019
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
12V
Power(Pd)
500mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSMD0603-020-12V 产品概述 — BHFUSE(佰宏)

一、产品简介

BSMD0603-020-12V 是 BHFUSE(佰宏)出品的一款微型复位式自恢复保险丝(PTC/Polyfuse),采用 0603 表贴封装,专为受限空间的直流过流保护设计。器件在过流时自动限流并在故障清除后复位,适合对体积、重量和可维护性有较高要求的消费电子及工业设备。

二、主要电气参数

  • 额定耐压(Vmax):12 V(最大工作电压)
  • 最大允许短时电流(Imax):40 A(用于短时浪涌或短路冲击能力评估)
  • 保持电流(Ihold):200 mA(在此电流下器件应保持未动作)
  • 跳闸电流(Itrip):500 mA(在此电流下器件将在规定时间内动作)
  • 动作时间:600 ms(典型值,基于标准测试条件)
  • 功耗(Pd):500 mW(正常稳态下的最大功耗限制)
  • 初始态电阻(Rmin):550 mΩ
  • 跳断后最大电阻(R1max):3.5 Ω
  • 工作温度范围:-40 ℃ 至 +85 ℃

三、机械与封装信息

  • 品牌:BHFUSE(佰宏)
  • 封装:0603 表贴(超小型)
  • 外形尺寸(典型):长度 1.85 mm × 宽度 1.05 mm × 高度 1.00 mm

四、典型应用场景

  • 小型直流电源线路保护(如 5–12V 设备的输入保护)
  • 通信/网络设备的局部电源保护
  • 工业控制模块、传感器节点的过流保护
  • 便携式设备、仪表和消费电子的小电流回路保护
  • LED 驱动及外围电路的短路保护(需注意额定电压与功耗匹配)

五、使用建议与注意事项

  • 放置位置:建议靠近电源输入端或需保护的负载入口处串联安装,以实现最快的过流响应和最小的保护盲区。
  • 环境影响:周围环境温度升高会降低器件的动作电流,应在高温环境下适当降额选择(选择 Ihold 与 Itrip 时留有裕量)。
  • 持续电流限制:虽然 Imax 标示为 40 A,但这是短时冲击能力,器件长期工作应以 Ihold 和 Pd 为设计依据,避免长期在高于额定功耗下工作。
  • 串联阻抗与电压降:初始电阻约 0.55 Ω,设计时应考虑在额定工作电流下产生的压降与发热。
  • 封装和焊接:采用常规 SMT 工艺回流焊贴装。具体焊接温度曲线请参照厂家工艺建议以避免热损伤。

六、可靠性与测试建议

  • 在量产前进行样机验证:在目标系统中验证在典型与极限工况下的动作行为、热耦合和恢复特性。
  • 温度循环与老化测试:在高低温、湿热及重复过流条件下验证器件稳定性与 R1max 变化趋势。
  • 安全与法规:若用于须符合特定安全标准(如汽车、医疗等),应与供应商确认对应的认证与可靠性数据。

七、选型要点与比较优势

  • 尺寸小、适合高密度 PCB 布局,适合轻量化、体积受限的应用;
  • 自恢复设计减少维护成本,不需更换物理熔断器;
  • 明确的 Ihold/Itrip 指标便于设计者按应用需求精确选型;
  • 注意:对长时间大电流及高功耗场合仍应优先考虑传统保险丝或配合限流电路以保证可靠性。

如需在具体电路中替换或对接更高电压/更高电流的保护元件,请提供完整的工作电流、工作温度、冲击电流及 PCB 布局信息,以便给出更精确的选型与布局建议。

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