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BHFUSE BSMD2920-300-24V BSMD2920
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BHFUSE BSMD2920-300-24V
- Type
- BHFUSE
- Minimum package
- 1500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- BHFUSE
- Electronic Component
- BSMD2920-300-24V
- Electronic Component
- 1
- Electronic Component
- 5.44mm
- Package
- 2920
- Electronic Component
- Resettable Fuse
- Electronic Component
- 0.179g
- Electronic Component
- 7.98mm
- Electronic Component
- 1.6mm
- Electronic Component
- 1
- Electronic Component
- 20s
- Electronic Component
- BM0226603803
- Operating Temperature
- 40℃~+85℃
- Voltage Rating(Vmax)
- 24V
- Power(Pd)
- 1.8W
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BSMD2920-300-24V 产品概述
一、产品简介
BSMD2920-300-24V 是佰宏（BHFUSE）推出的一款表面贴装自恢复保险（PTC Resettable Fuse），封装规格为 2920（7.98 × 5.44 × 1.6mm）。该器件用于过流保护与过温保护，能在短路或异常电流下快速限制电流并在故障消除后自动恢复，适合便携设备、电源模块与车载电子等需重复保护场景。
二、主要性能参数
- 耐压（Vmax）：24 V
- 最大电流（Imax）：40 A
- 保持电流（Ihold）：3 A（常温下最大允许长期通过电流）
- 跳闸电流（Itrip）：6 A（典型触发使阻值显著上升）
- 动作时间：20 s（在规定条件下由低阻到限流状态所需时间）
- 功耗（Pd）：1.8 W（在规定工作点产生的热功率）
- 初始态阻值（Rmin）：12 mΩ
- 跳断后阻值（R1max）：48 mΩ
- 工作温度范围：-40 ℃ ～ +85 ℃
三、结构与封装
BSMD2920-300-24V 采用 2920 SMD 封装，外形尺寸为长 7.98mm、宽 5.44mm、高 1.6mm，适合自动贴片生产与回流焊工艺。低厚度便于在有限空间内布局，金属端子设计利于焊接可靠性与散热。
四、产品特点
- 可复位设计：过流解除后自动恢复无需更换，降低维护成本。
- 响应稳定：6A 跳闸电流与 20s 的动作时间配合，可在短时突发过流中有效限流。
- 低初始阻值：12mΩ 起始阻值，减少正常工作下的压降与发热。
- 高最大承受：40A 峰值能力，能承受并限制高短路电流。
- 宽温度适应性：-40℃ 到 +85℃ 满足工业与车载环境要求。
五、应用建议与注意事项
- 将器件放置在通过流体或有良好散热的区域，以利于热量扩散并确保动作特性稳定。
- 选择时以实际工作电流与启动（浪涌）特性为依据：若长期工作电流接近或超过 Ihold，应选更高规格以避免误动作。
- 在高频或脉冲负载下，需验证器件在实际脉冲条件下的动作时间与温升。
- 回流焊温度曲线应按厂家推荐，避免超温导致性能退化。
六、可靠性与储存
本器件适合常规电子元器件储存条件，避免潮湿、强酸碱环境与长时间日光直射。长时间存放前建议按标准干燥保存并在贴片前进行必要的回潮处理（如厂家有明示要求则按其执行）。
七、品牌与采购
品牌：BHFUSE（佰宏），封装：2920。型号命名 BSMD2920-300-24V 对应保持电流约 3A、系统最高工作电压 24V。采购时请确认批次与具体电气曲线，以确保在目标应用工况下的动作特性吻合使用需求。若需更详细的 I‑T 曲线、热阻或封装 3D 模型，可向供应商索取完整数据手册。
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