WMSIC Electronic Components

BHFUSE BSMD1812-200-8V BSMD1812

ModelBSMD1812-200-8V
Package1812
BrandBHFUSE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BHFUSE BSMD1812-200-8V
Type
BHFUSE
Minimum package
1500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BHFUSE
Electronic Component
BSMD1812-200-8V
Electronic Component
1
Electronic Component
3.41mm
Package
1812
Electronic Component
Resettable Fuse
Electronic Component
0.131g
Electronic Component
4.73mm
Electronic Component
1.3mm
Electronic Component
1
Electronic Component
2s
Electronic Component
BM0229474032
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
8V
Power(Pd)
1W

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSMD1812-200-8V 产品概述

一、产品简介

BSMD1812-200-8V 是佰宏(BHFUSE)出品的一款SMD型自恢复过流保护器件(PTC/自恢复保险),封装尺寸为1812,适合表面贴装工艺。器件设计用于对低压直流电路提供过流保护,发生过流时自动限流并在故障解除后恢复原始状态,适用于对可重复短路或突发浪涌有保护需求的电子系统。

二、主要性能参数

  • 品牌:BHFUSE(佰宏)
  • 封装:1812
  • 长度:4.73 mm;宽度:3.41 mm;高度:1.3 mm
  • 初始态阻值 (Rmin):20 mΩ
  • 跳断后阻值 (R1max):100 mΩ
  • 保持电流 (Ihold):2 A
  • 跳闸电流 (Itrip):4 A(典型动作电流)
  • 最大电流 (Imax):100 A(可承受短时脉冲电流)
  • 耐压 (Vmax):8 V
  • 消耗功率 (Pd):1 W(在规定条件下的功耗极限)
  • 动作时间:约 2 s(在规定过流条件下的典型动作时间)
  • 工作温度范围:-40 ℃ ~ +85 ℃

三、典型特性说明

  • 低初始阻值(20 mΩ)确保正常工作时的压降小、发热低,适合对电压损耗要求严格的电源分配线路。
  • 在过流或短路条件下,器件温升使阻值上升至最大约100 mΩ,从而限制电流,保护下游电路。
  • 保持电流2 A 表示在此电流及以下器件长期保持闭合状态;当电流达到约4 A 时器件将在典型2 s 时间内动作限流。
  • 最大电流100 A 表示器件能承受较短时间的冲击电流,但不应作为长期工作参数使用,应结合系统保护策略设计。

四、应用场景

  • USB/数据端口、充电接口过流保护
  • 电池管理与便携式设备的短路保护
  • 通信设备、机顶盒、路由器的电源保护
  • 工业控制低压DC电源分路保护
    (适用于需自动复位功能、重复保护与低压环境的场合)

五、安装与使用注意事项

  • 电压不得超过标称最大耐压8 V;超过该值会影响动作特性并可能损坏器件。
  • 设计电路时应保证长期工作电流低于 Ihold(建议留有安全裕量),避免器件频繁触发导致寿命降低或热累积。
  • Imax 为短时冲击承受能力,不作为持续工作电流;若存在大电流冲击,应验证热冲击和焊点可靠性。
  • PCB 布局应为器件提供良好散热路径,焊盘尺寸和金属过孔应符合厂商建议,避免机械应力。
  • 焊接与回流时请遵循厂商的焊接工艺规范(避免超温或超时造成器件性能损伤)。
  • 环境温度对保持电流与跳闸电流有显著影响,高温会降低器件允许电流,应在系统热环境中进行确认。

六、可靠性与资料获取

该器件适合反复动作的自恢复保护场景,但设计时应结合实际负载特性进行寿命评估。欲获取详细I–t曲线、温漂特性、回流焊工艺参数及认证资料,请向佰宏官方或授权分销商索取完整数据手册与样片,以便在目标应用中进行验证测试。

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