WMSIC Electronic Components

BHFUSE BSMD2920-200-36V BSMD2920

ModelBSMD2920-200-36V
Package2920
BrandBHFUSE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BHFUSE BSMD2920-200-36V
Type
BHFUSE
Minimum package
1500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BHFUSE
Electronic Component
BSMD2920-200-36V
Electronic Component
1
Electronic Component
5.44mm
Package
2920
Electronic Component
Resettable Fuse
Electronic Component
0.189g
Electronic Component
7.98mm
Electronic Component
1.4mm
Electronic Component
1
Electronic Component
4.5s
Electronic Component
BM0229474040
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
36V
Power(Pd)
2W

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSMD2920-200-36V 产品概述

一、产品简介

BSMD2920-200-36V 是佰宏(BHFUSE)推出的一款表面贴装自恢复保险(PTC/聚合物基翘曲式),封装尺寸为 2920(长度 7.98mm × 宽度 5.44mm × 高度 1.4mm)。器件在额定电压 36V 下工作,设计用于过流保护与短路限流,适合工业与消费类电源前端、电池管理与接口保护等场景。

二、核心电气参数

  • 最大耐压(Vmax):36V
  • 最大允许电流(Imax):40A(瞬态或短时峰值,请参照具体应用环境与热设计)
  • 保持电流(Ihold):2A(器件在此电流下长期保持低阻状态)
  • 跳闸电流(Itrip):4A(在超过该电流并满足时间条件时进入高阻态)
  • 跳断后最大阻值(R1max):120mΩ
  • 初始态阻值(Rmin):20mΩ
  • 消耗功率(Pd):2W(器件在特定条件下的功耗限制)
  • 动作时间:4.5s(典型动作时间,依据具体过流倍数与温度有所差异)
  • 工作温度范围:-40℃ ~ +85℃

以上数据为器件典型或规格值,具体应用中建议参考厂家详细数据表及曲线。

三、主要特点与优势

  • 低初始阻值(20mΩ),在正常工作时压降小、效率高;
  • 明确的保持/跳闸电流等级(2A/4A),便于设计者选型与电路保护策略制定;
  • 自恢复特性:过流解除后自动回复低阻态,减少更换成本与停机时间;
  • 适配表面贴装工艺,便于自动化生产与高密度布板;
  • 宽温区工作能力,满足多数工业与消费电子使用环境。

四、典型应用

  • 电池组与充电管理(如锂电池防护)
  • 电源输入前端过流保护(适用于充电器、适配器、电源模块)
  • 通讯与数据接口(例如 USB、POE 限流保护,需核实电压与功率匹配)
  • 工业控制与电机驱动辅助保护(作为一级或二级保护元件)

五、选型与布局建议

  • 留有至少 20%~50% 的裕量:在实际系统中建议选择保持电流大于正常最大工作电流,以防误动作;
  • 热管理:器件功耗 Pd、封装热阻与 PCB 铜箔面积直接影响温升,建议在器件焊盘周围保留足够铜箔并配置热散路径;
  • 焊接工艺:推荐采用符合无铅回流的标准曲线,避免长时间高温超出器件耐受范围;具体回流曲线请参照厂方资料;
  • 布局:避免将敏感元件(如模拟放大器、温度传感器)紧邻器件热源,且输入端应尽量采用短且宽的走线以降低寄生电阻和发热。

六、可靠性与使用注意

  • 自恢复器件并非瞬时熔断器,对频繁持续的过流或热应力应评估寿命影响;
  • 长时间在接近 Pd 功耗极限下工作会加速老化,建议设计中留有安全裕度;
  • 出现反复跳闸或永久高阻(R1max 显著增大)时,应检查是否存在持续短路或器件受损,并按规范更换;
  • 存储与焊接前请避免受潮并遵循湿敏等级(MSL)处理,详细信息以产品数据手册为准。

如需完整性能曲线、浪涌能力、热阻参数或封装焊盘尺寸图纸,可提供原厂数据手册以便进一步的电路仿真与可靠性评估。

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