WMSIC Electronic Components

BHFUSE BSMD1812L-800-12V BSMD1812L

ModelBSMD1812L-800-12V
Package1812
BrandBHFUSE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BHFUSE BSMD1812L-800-12V
Type
BHFUSE
Minimum package
1500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BHFUSE
Electronic Component
BSMD1812L-800-12V
Electronic Component
1
Electronic Component
3.6mm
Package
1812
Electronic Component
Resettable Fuse
Electronic Component
0.114g
Electronic Component
4.9mm
Electronic Component
1.4mm
Electronic Component
1
Electronic Component
5s
Electronic Component
BM0257220532
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
12V
Power(Pd)
1.5W

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSMD1812L-800-12V 产品概述

一、产品简介

BSMD1812L-800-12V 是佰宏(BHFUSE)推出的一款低阻抗表面贴装自恢复过流保护元件(SMD PPTC/复位保险型设计),封装为常用的 1812 尺寸,采用涂胶封边工艺以增强焊接可靠性与环境耐受性。该器件设计用于 12V 等低压直流系统的过流保护,具有快速跳闸和自动复位的特性,可在异常电流消除后恢复导通状态,便于重复使用和降低维护成本。

二、主要电气参数

  • 最高耐压(Vmax):12 V
  • 最大允许电流(Imax):50 A
  • 保持电流(Ihold):8 A(长期安全通过电流)
  • 跳闸电流(Itrip):16 A(在规定条件下开始显著升阻并限制电流)
  • 跳断后功耗(Pd):1.5 W(参考值)
  • 初始态电阻(Rmin):0.5 mΩ(上电前或无热累积时的低电阻)
  • 跳断后最大电阻(R1max):10 mΩ(激活后的高阻限流状态)
  • 动作时间:约 5 s(在 Itrip 条件下达到动作阈值的参考时间)
  • 工作温度范围:-40 ℃ 到 +85 ℃

三、机械尺寸与封装

  • 尺寸:长 4.9 mm × 宽 3.6 mm × 高 1.4 mm
  • 封装类型:1812 SMD
  • 表面处理:端部涂胶封边(低阻涂胶封边),有利于提高机械强度、减少焊接裂纹并改善环境密封性。

四、主要特性与优势

  • 低初始电阻:设备在正常工作态阻值极低(0.5 mΩ 级),可用于对压降敏感的功率通路,降低系统发热与损耗。
  • 快速保护与自动复位:在短路或突发过流事件时可在规定时间内动作并限制电流,事件解除后恢复导通,方便维护与长寿命使用。
  • 小型化封装:1812 标准封装便于高速贴片生产和空间受限电路板布局。
  • 涂胶封边工艺:改善焊点质量与环境耐受性,适合对可靠性有较高要求的场合。

五、典型应用场景

  • 12V 电源总线保护(汽车电子、车载设备需先确认相关认证)
  • 电池保护与电源管理模块
  • LED 驱动电路短路防护
  • USB、DC-DC 模块与充电设备的过流保护
  • 工业控制与通信设备的输入侧保护

六、设计与使用建议

  • 在实际应用中建议对工作电流、最大短路电流及环境温度进行热仿真与实测,以确定在系统极限条件下的动作时间与热稳定性。
  • 设计布局时应保证器件两侧焊盘有足够铜面积以利散热,并按厂商推荐的 PCB 尺寸与回流焊工艺参数进行焊接。
  • 若应用于汽车或高可靠场景,需配合系统级保护方案(如熔断器、限流器、监控电路)并进行整车/系统验证。
  • 存储与焊接:避免长期暴露于高湿环境,遵循正常的 SMD 元件存储与回流焊工艺规范。

七、订购信息

  • 品牌:BHFUSE(佰宏)
  • 型号:BSMD1812L-800-12V
  • 封装:1812,涂胶封边
  • 如需样品、电特性曲线或推荐 PCB 尺寸图,请在采购或样品咨询时向供应商索取完整数据手册与可靠性测试报告。

注:以上参数为器件典型设计值,具体在不同测试条件(温度、焊接工艺、波形短路等)下可能有所变化。正式设计与量产前请依据厂商最新资料与实测结果进行验证。

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