WMSIC Electronic Components

BHFUSE BSMD1812-260-24V BSMD1812

ModelBSMD1812-260-24V
Package1812
BrandBHFUSE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BHFUSE BSMD1812-260-24V
Type
1812
Minimum package
1500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BHFUSE
Electronic Component
BSMD1812-260-24V
Electronic Component
1
Electronic Component
3.41mm
Package
1812
Electronic Component
Resettable Fuse
Electronic Component
0.119g
Electronic Component
4.73mm
Electronic Component
1.5mm
Electronic Component
1
Electronic Component
2.5s
Electronic Component
BM0231067989
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
24V
Power(Pd)
1.2W

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSMD1812-260-24V 产品概述

一、产品简介

BSMD1812-260-24V 是佰宏(BHFUSE)出品的一款1812封装的PTC自恢复保险丝,用于对电路中的过流和短路故障提供自动保护。器件在正常工作时呈低阻抗,当电流超过一定阈值时迅速加热、阻值显著上升以限制电流并保护下游器件;故障解除后随着冷却自动恢复低阻态,适合需要重复保护且不便更换熔断器的场合。

二、主要参数

  • 最大耐压(Vmax):24 V
  • 标称最大电流(Imax):40 A(数据表条件下)
  • 保持电流(Ihold):2.6 A(器件在不触发条件下长期允许通过的最大电流)
  • 跳闸电流(Itrip):5.2 A(在规定时间内开始动作的电流阈)
  • 功耗(Pd):1.2 W(典型条件下)
  • 初始态电阻(Rmin):10 mΩ
  • 跳断后最大电阻(R1max):70 mΩ
  • 动作时间:约 2.5 s(在指定过流条件下)
  • 工作温度:-40 ℃ ~ +85 ℃
  • 尺寸(L×W×H):4.73 mm × 3.41 mm × 1.50 mm(1812 SMD)

三、性能特点

  • 低阻抗启动:初始态阻值仅约10 mΩ,适合对压降敏感的电源路径。
  • 快速自保护:在过流状态下约2.5秒动作,将阻值提升至最高约70 mΩ以限制电流。
  • 自动恢复:故障解除后随着冷却可自动恢复到低阻态,支持多次循环保护。
  • 紧凑封装:1812 尺寸适配自动贴片组装,节省PCB空间。
  • 宽温度范围:-40 ℃ 到 +85 ℃,适应多种环境。

四、典型应用

  • 24V 车载或工业控制总线短路保护(注意车规使用需结合认证)
  • 电源输入保护、DC-DC模块二次侧保护
  • 电池管理系统(BMS)与便携设备的过流保护
  • 通讯设备、安防设备以及其他需自动复位保护的电路

五、选型与PCB布局建议

  • 选型原则:长期工作电流应低于 Ihold(留有裕量),常见做法是将正常运行电流控制在 Ihold 的 60%~80% 范围内;若系统允许短时冲击电流,可参考 Itrip 值与动作时间匹配。
  • 温度与散热:环境温度或邻近器件发热会降低器件承载能力,必要时应在布局时考虑散热铜箔和间距以降低器件温升。
  • 布局建议:将器件放在靠近被保护输入/负载的电流路径上,保证焊盘与铜箔足够,避免温度敏感器件紧邻,以免误触发。
  • 焊接工艺:采用标准SMD回流焊工艺,遵循厂家推荐的温度曲线以避免性能退化。

六、可靠性与注意事项

  • 允许多次动作与恢复,但频繁触发会影响元件寿命与特性稳定性,应排查上游故障原因。
  • Imax、Pd 等参数以制造商数据表为准,系统设计应参考完整数据表和热设计指南。
  • 用于汽车或关键领域时,需确认器件的认证等级与实际运行条件匹配。

如需详细数据表、热阻曲线或回流焊推荐曲线,可联系供应商获取完整技术文件,以便在实际设计中完成更精确的电热仿真与选型验证。

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