WMSIC Electronic Components

BHFUSE BSMD2920-700-12V BSMD2920

ModelBSMD2920-700-12V
Package2920
BrandBHFUSE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BHFUSE BSMD2920-700-12V
Type
BHFUSE
Minimum package
1500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BHFUSE
Electronic Component
BSMD2920-700-12V
Electronic Component
1
Electronic Component
5.44mm
Package
2920
Electronic Component
Resettable Fuse
Electronic Component
0.237g
Electronic Component
7.98mm
Electronic Component
1.6mm
Electronic Component
1
Electronic Component
6s
Electronic Component
BM0229474018
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
12V
Power(Pd)
2W

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSMD2920-700-12V 产品概述

一、产品简介

BSMD2920-700-12V 是佰宏(BHFUSE)推出的一款表面贴装自恢复保险丝(PPTC),封装规格为 2920(尺寸约 7.98 × 5.44 × 1.6 mm)。该器件适用于低压直流保护场合,能在过流时迅速限流并在故障清除后自动恢复,便于重复使用,降低维护成本。

二、主要技术参数

  • 耐压(Vmax):12 V
  • 最大电流(Imax):40 A(短时承受峰值电流,须参考应用工况)
  • 保持电流(Ihold):7 A(在规定温度下能长期承载而不动作)
  • 跳闸电流(Itrip):14 A(在规定条件下会动作并进入高阻态)
  • 消耗功率(Pd):2 W(额定功耗或特定测试点功耗)
  • 初始态阻值(Rmin):2.5 mΩ(常温、未动作时典型低阻值)
  • 跳断后阻值(R1max):10 mΩ(动作后进入高阻态的上限)
  • 工作温度:-40 ℃ ~ +85 ℃
  • 尺寸:长度 7.98 mm × 宽度 5.44 mm × 高度 1.6 mm
  • 品牌/封装:BHFUSE(佰宏),2920 SMD

三、产品特点与优势

  • 自恢复功能:过流后自动进入高阻态限流,故障解除后自动冷却恢复,适合重复过流工况。
  • 低初始阻值:2.5 mΩ 起,降低正常工作时的功耗与热量产生。
  • 快速保护:14 A 的跳闸电流能够在短时突发过流时提供有效保护。
  • 宽温度适应性:-40 ℃ 至 +85 ℃,适用于工业、消费类等多种环境。
  • SMD 封装:便于自动贴装与高速生产线集成,节省 PCB 布局空间。

四、典型应用场景

  • 移动电源、车载电子(12V 近端供电线路)短路及过流保护;
  • 通信设备、路由器、交换机的输入电源保护;
  • 消费电子(充电器、平板、笔记本扩展电路)及小型工控设备的电源保护;
  • 任何需重复使用且空间受限的低压直流保护场合。

五、选型与使用建议

  • 常态工作电流应小于 Ihold(建议留有裕量),以避免长期发热导致动作。
  • 设计中若可能出现短时浪涌电流,应确认 Imax 能承受该峰值且不损坏器件。
  • 注意环境温度对保持电流和跳闸特性的影响:高温会降低 Ihold,必要时进行热仿真或升温试验。
  • 布局时避免将热源紧邻器件,留出散热空间;SMD 焊盘应按厂家推荐的 PCB land pattern 设计并采用合适的回流焊工艺(建议参照厂商焊接规范)。

六、可靠性与检验

  • 建议在样机阶段进行过流/复位循环寿命测试、环境高低温循环以及浪涌承受试验,验证在具体系统中的稳定性。
  • 关注 Pd(消耗功率)与器件温升关系,必要时测定热阻并评估长期可靠性。

总结:BSMD2920-700-12V 以其低阻、快速自恢复保护和紧凑 SMD 封装,适合多种 12V 及以下的低压直流保护应用。在设计时应合理留裕、注意热管理并遵循制造商的 PCB 与焊接推荐,以发挥最佳保护效果与长期可靠性。若需进一步的电气特性曲线或焊盘图,请参考佰宏的完整数据手册或联系供应商获取样品与测试报告。

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