WMSIC Electronic Components

BHFUSE BSMD2920-400-30V BSMD2920

ModelBSMD2920-400-30V
Package2920
BrandBHFUSE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BHFUSE BSMD2920-400-30V
Type
BHFUSE
Minimum package
1500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BHFUSE
Electronic Component
BSMD2920-400-30V
Electronic Component
1
Electronic Component
5.44mm
Package
2920
Electronic Component
Resettable Fuse
Electronic Component
0.064g
Electronic Component
7.98mm
Electronic Component
1
Electronic Component
4s
Electronic Component
BM0226603842
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
30V
Power(Pd)
2.5W
Current(Imax)
40A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSMD2920-400-30V 产品概述

一、产品简介

BSMD2920-400-30V 为佰宏(BHFUSE)推出的一款表面贴装自恢复型过流保护器件(PTC/resettable fuse),封装型号为 2920(尺寸:宽 5.44 mm,长 7.98 mm)。本品针对 30V 以内电源系统的过流和短路保护设计,特点是低初始阻值、可重复自恢复、适用宽温区间(-40℃ 至 +85℃),适合消费电子、工业控制及通信终端等场景作为一次性或反复保护元件使用。

二、主要性能参数

  • 品牌:BHFUSE(佰宏)
  • 封装:2920(SMD)
  • 工作温度:-40℃ ~ +85℃
  • 最大工作电压 Vmax:30 V
  • 消耗功率 Pd:2.5 W(最大)
  • 初始态阻值 Rmin:8 mΩ(典型低电阻,利于降低功率损耗)
  • 跳断后阻值 R1max:40 mΩ(跳闸后显著增加阻抗,限制故障电流)
  • 保持电流 Ihold:4 A(在额定环境下长时间通过不会触发)
  • 跳闸电流 Itrip:8 A(在接近该电流水平时开始进入自保护状态)
  • 最大允许电流 Imax:40 A(短时脉冲及过电流承受能力)
  • 动作时间:约 4 秒(在接近标称跳闸电流时的典型响应时间)

三、产品特性与优势

  • 低初始电阻(≈8 mΩ),导通损耗小,有利于热敏感与高效率电路设计。
  • 自恢复能力强:过流或短路后进入高阻态,故障解除后可自动冷却恢复,避免更换。
  • 宽温工作范围,适应工业级与户外设备的环境变化。
  • 封装适配表面贴装工艺,便于自动化贴装与高密度 PCB 设计。
  • 额定 30 V 的电压范围覆盖常见车载辅助电源、通讯电源以及工业 24 V/12 V 系统。

四、典型应用

  • 车载电子 12V/24V 辅助回路的短路与反接保护(需确认整车系统最大电压)。
  • 工业控制器、PLC 的电源输入保护模块。
  • 通信设备、路由器、电源适配器等的输出过流保护。
  • 电池管理系统(BMS)中的外围保护与分支电路防护(在电压与热条件满足时)。

五、选型与使用建议

  • 常态工作电流应低于 Ihold(4A),以确保长期可靠性;若电路存在短时间高电流冲击(浪涌、启动电流),请评估脉冲特性并参考厂商浪涌曲线。
  • 若工作电压或持续功率接近上限,应选择更高规格或并联采用厂方推荐方案以降低发热。
  • 设计 PCB 时保留合适的焊盘与散热铜箔,避免器件长期处于高温工作点影响自恢复性能。
  • 对关键应用建议向佰宏索取详细的时间—电流特性曲线(I–t)、温度上升曲线与回流焊兼容性资料,以完成可靠性评估。

六、安装与可靠性注意事项

  • 遵循厂方推荐的回流焊工艺,避免过高温度和过长焊接时间造成材料性能退化。
  • 器件附近避免产生大热源或强机械应力,贴片区应保证良好焊接质量以防接触热阻异常。
  • 在高湿、高温或振动环境中,应结合封装周边保护与热管理措施提升长期稳定性。

如需更详细的 I–V、I–t 曲线、封装尺寸图或可靠性测试报告,可联系佰宏或提供样品以获取制造商完整数据手册,便于在具体系统中进行精确选型与验证。

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