Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BHFUSE BH60-110 BH60
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BHFUSE BH60-110
- Type
- BHFUSE
- Minimum package
- 500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- BHFUSE
- Electronic Component
- BH60-110
- Electronic Component
- 1
- Package
- Through-hole, P=5.1mm
- Electronic Component
- Resettable Fuse
- Electronic Component
- 0.454g
- Electronic Component
- 1
- Electronic Component
- BM0228072396
- Operating Temperature
- 40℃~+85℃
- Voltage Rating(Vmax)
- 60V
- Power(Pd)
- 1.51W
- Current(Imax)
- 40A
- Electronic Component
- Electronic Component
- Electronic Component
- 500
- Latching Current(Ihold)
- 1.1A
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BH60-110 产品概述
一、产品简介
BH60-110（品牌：BHFUSE / 佰宏）是一款针对电源侧过流保护的自恢复式保护器件（PPTC 型）。器件额定耐压 60V，采用插件封装（引脚间距 P=5.1mm），适合 PCB 插装或模块化电源入口的保护设计，可在过流后自动断开并在故障消除后恢复导通，减少维护频率并提高系统可用性。
二、主要参数
- 耐压（Vmax）：60V
- 最大瞬时电流（Imax）：40A（短时耐受，不作为长期导通电流）
- 保持电流（Ihold）：1.1A（在此电流下器件长期保持低阻态）
- 跳闸电流（Itrip）：2.2A（超过此值器件进入高阻态以限制电流）
- 功耗/耗散（Pd）：1.51W
- 初始态阻值（Rmin）：140mΩ
- 跳断后阻值（R1max）：375mΩ
- 工作温度：-40℃ ~ +85℃
- 封装：插件，P=5.1mm
三、产品特性
- 自恢复过流保护：过流后自动限流，故障消除后自动复位，无需更换元件。
- 低初始阻抗：Rmin 约 140mΩ，适合要求较低压降的供电路径。
- 明确的保持/跳闸电流：Ihold 与 Itrip 值利于精确选型以兼顾启动涌流和长期工作电流。
- 宽温工作范围，适合室温及轻工业环境。
- 插件结构便于装配与维修。
四、典型应用场景
- 开关电源及适配器输入保护
- 电池管理与便携设备（过流保护与短路防护）
- 工业控制器、电机驱动前端保护（配合限流设计）
- LED 驱动、电源模块、通信设备和消费电子的端口保护
五、选型与使用建议
- 选型原则：保证器件 Ihold 高于预期最大连续工作电流（留有合适裕量），Itrip 应高于正常启动浪涌但低于被保护电路可承受的损坏电流。
- 关于 Imax：40A 为器件短时耐受能力，不能作为连续额定电流使用，应避免长期工作在接近该值的条件下。
- 温度与热通量：环境升温会降低器件跳闸电流，设计时应对高温工况进行降额或留裕量，并避免器件附近有大热源。
- 布局建议：器件靠近电源入口或需保护元件放置，保证良好散热与气流，插件焊盘与走线需满足电流承载能力。
- 不建议并联多只使用以提高电流能力（并联可能导致不均流与不可靠行为）。
- 焊接与装配：为插件件，按厂家推荐的焊接与波峰/手工焊接工艺操作，避免过热或长时间加热影响性能。
六、可靠性与维护
PPTC 类自恢复保护器件在频繁触发后可能出现阻值上升或性能退化，应在设计中考虑触发频率与长期老化对电路性能的影响。关键设备应在系统测试中验证器件在实际工况下的跳闸与恢复特性。
如需 Datasheet（详细电流-时间特性曲线、热阻、焊接工艺与可靠性数据），可联系供应商或索取佰宏官方技术资料，我可以帮你进一步解读并给出具体电路选型建议。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
