Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BELLING BL9161G-18BADRN BL9161G
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BELLING BL9161G-18BADRN
- Type
- BELLING
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- 510mV@(300mA)
- Electronic Component
- BELLING
- Electronic Component
- 180uVrms
- Electronic Component
- BL9161G-18BADRN
- Electronic Component
- 1
- Package
- DFN-4L(1x1)
- Electronic Component
- Linear Regulator(LDO)
- Electronic Component
- 0.02g
- Electronic Component
- 1
- Features
- Output
- Electronic Component
- BM0221161355
- Operating Temperature
- 40℃~+85℃
- Operating Voltage
- 6V
- Output
- Electronic Component
- Output Voltage
- 1.8V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：BL9161G-18BADRN
品牌与封装信息 BL9161G-18BADRN 是 BELLING（贝岭）推出的一款高效能模拟集成电路，采用 DFN-4L(1x1) 封装形式。DFN(双面封装无引脚)封装以其超小尺寸和高热导性能而广受欢迎，适合在空间受限的应用中使用，且具有优良的电气性能和散热特性。
功能与特点 BL9161G-18BADRN 是一款高精度的电压参考 IC，主要用于提供稳定的参考电压输出。该产品具有以下几个优点：
- 高精度：该器件的输出电压非常稳定，典型值可达到±0.5%的精度，符合高精度应用的需求。
- 低功耗：在工作状态下，BL9161G-18BADRN 消耗的电流非常低，适合便携式设备和电池供电应用，能够有效延长设备的使用时间。
- 宽输入电压范围：此 IC 能够支持宽范围的工作电压，使得它在不同应用中都能表现出良好的兼容性。
- 良好的温度稳定性：BL9161G-18BADRN 具备优良的温度系数特性，能够在不同环境温度下保持输出电压的稳定性，适合各种苛刻的应用环境。
应用场景 BL9161G-18BADRN 的应用场景非常广泛，主要包含但不限于以下几个方面：
- 消费电子：用于智能手机、平板电脑、电子表等消费类电子设备中的电源管理。
- 工业控制：在工业自动化系统中，作为传感器、PLC 和其他工业设备的电压参考元件。
- 汽车电子：应用于汽车内部电气系统，如车载导航、车用电子控制单元等。
- 医疗设备：在医疗监测仪器中，BL9161G-18BADRN 可以提供稳定的电压源，确保设备的可靠性和安全性。
设计注意事项 当设计和实施 BL9161G-18BADRN 时，存在一些关键设计考虑因素：
- 布局与布线：由于 DFN 封装的特性，建议在 PCB 设计时保持良好的地平面，确保优良的电源分配与 EMI 抑制。
- 输入电容：在输入端添加适当的旁路电容，以提供瞬态电流需求并抗干扰。
- 热管理：虽然 BL9161G-18BADRN 属于低功耗元件，但在高电流驱动场景下，合理的热设计仍然是必要的，以确保稳定性和可靠性。
结论
BL9161G-18BADRN 是 BELLING（贝岭）推出的一款性能卓越的电压参考 IC，非常适合高精度和低功耗的应用场景。凭借其小巧的 DFN-4L(1x1) 封装和优异的电气性能，BL9161G-18BADRN 为现代电子设计提供了强有力的支持，是各类电子产品中极具价值的集成电路解决方案。
该产品适合各个行业的设计者选用，能够有效提升最终产品的性能与可靠性，是电源管理与信号处理应用中的理想选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
