WMSIC Electronic Components

BELLING BL24C16F-NTRC BL24C16F

ModelBL24C16F-NTRC
PackageUDFN-8L(2x3)
BrandBELLING
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BELLING BL24C16F-NTRC
Type
BELLING
Minimum package
3000 卷

Technical parameters

Electronic Component
BELLING
Electronic Component
BL24C16F-NTRC
Electronic Component
1
Package
UDFN-8L(2x3)
Electronic Component
EEPROM
Electronic Component
0.049g
Electronic Component
1
Electronic Component
BM0227759670
Electronic Component
16Kbit
Operating Temperature
40℃~+85℃
Operating Voltage
1.7V~5.5V
Interface Type
I2C
Electronic Component
100
Clock Frequency(fc)
1MHz
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BL24C16F-NTRC 产品概述

一、产品简介

BL24C16F-NTRC 是贝岭(BELLING)推出的一款 16Kbit 串行 EEPROM,采用 UDFN-8L (2x3) 小封装,面向工业级和消费类低功耗存储应用。器件通过标准 I2C 接口与主控器通讯,支持高达 1MHz 的时钟频率,工作电压范围宽(1.7V~5.5V),适应性强。器件在-40℃到 +85℃工作温度范围内稳定运行,数据保持时间(TDR)可达 100 年,写周期寿命高达 100 万次,兼顾长期可靠性与高耐用性,适用于需要频繁写入及长期存储的场景。

二、主要特点

  • 存储容量:16Kbit(2KB)
  • 接口类型:I2C(兼容标准 I2C、Fast-mode、Fast-mode Plus,最高支持 1MHz)
  • 工作电压:1.7V ~ 5.5V,适配多种电源域
  • 工作温度:-40℃ ~ +85℃
  • 数据保持(TDR):100 年(典型或保证值,请以真确数据手册为准)
  • 写周期寿命:1,000,000 次(高耐久)
  • 写周期时间(Tw):3ms(单页/字节写入内部完成所需最大时间)
  • 封装:UDFN-8L (2x3) 小型封装,适合空间受限应用
  • 供应商:BELLING(贝岭)

三、关键规格说明(要点解读)

  • 时钟上限 1MHz:支持 I2C Fast-mode Plus(1MHz),可在高带宽或快速响应需求下减少总线占用时间。设计时需保证总线上各设备兼容该速率并正确配置上拉电阻。
  • 电压兼容性:1.7V 到 5.5V 的宽电压范围,使该器件可在单节锂电池(约 3.0–4.2V)、3.3V 与 5V 系统中工作,便于在多种平台上直接使用。
  • 写周期与写时延:Tw = 3ms 表示每次内部写操作完成所需的最大时间。一般设计建议采用写完成轮询(ACK polling)或等待时间策略来确认写入已完成,避免在写操作未完成时发起新的操作导致数据错误。
  • 数据保持与寿命:100 年的数据保持能力和 1,000,000 次写入寿命,适合需要长期保存参数、校准数据或累计计数等应用,但实际寿命受工作温度、写入频率及存储条件影响,应结合系统级策略进行管理。

四、封装与引脚建议

  • 封装:UDFN-8L (2x3),小体积、适合表贴。封装尺寸紧凑,适合便携设备、模块化板卡或空间受限的嵌入式系统。
  • 引脚与布局建议:
    • 为 SDA、SCL 提供合适的上拉电阻(典型值视总线电容和目标速率而定,1MHz 时常用 1kΩ~10kΩ 范围)
    • 在 VCC 与 GND 之间放置去耦电容(例如 0.1µF 陶瓷)靠近引脚以抑制瞬态
    • 若器件具备 WP(写保护)引脚,可根据需求将其接到合适电平以防止误写;具体连接请参照厂商数据手册
    • 注意焊接工艺与回流曲线,UDFN 封装对焊接热剖面敏感,应遵循厂家推荐的回流温度_PROFILE_

五、典型应用场景

  • 消费电子:配置参数、校准常数、用户设置存储
  • 工业控制:非易失性日志、设备参数与标定数据保存
  • 智能表计与传感终端:累计计数、事件记录与固件版本信息
  • 可穿戴与低功耗终端:由于宽电压与低功耗特性,适合移动设备与电池供电系统

六、设计与使用建议

  • 尽量采用顺序/页写以减少总写次数,从而延长器件寿命(页大小请参照数据手册并按页对齐写入)
  • 实施写保护策略(软件或硬件)以避免误操作写入
  • 在系统层面做磨损均衡(若频繁更新相同地址,可考虑轮换地址段或外部管理策略)
  • 对于关键数据,可在写入后采用多副本与校验机制(CRC)以提高可靠性
  • 使用 ACK Polling 或读取器件状态以判断写操作完成,替代固定延时等待,以提升效率

七、结论

BL24C16F-NTRC 提供了小封装、高耐久和宽电压范围的非易失性存储解决方案,适合对体积、可靠性与兼容性有较高要求的嵌入式应用。结合合理的总线设计与写入管理策略,能够在多类终端中长时间稳定工作。采购与最终设计时,建议参考贝岭官方数据手册以获取完整引脚定义、时序与封装尺寸信息,确保设计与焊接工艺满足器件要求。

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