WMSIC Electronic Components

BELLING BL24CM1A-NTRC BL24CM1A

ModelBL24CM1A-NTRC
PackageUDFN-8L(2x3)
BrandBELLING
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BELLING BL24CM1A-NTRC
Type
BELLING
Minimum package
3000 卷

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BELLING
Electronic Component
BL24CM1A-NTRC
Electronic Component
1
Package
UDFN-8L(2x3)
Electronic Component
EEPROM
Electronic Component
0.051g
Electronic Component
1
Electronic Component
BM0228055581
Electronic Component
1Mbit
Operating Temperature
40℃~+85℃
Operating Voltage
1.7V~5.5V
Interface Type
I2C
Electronic Component
400
Clock Frequency(fc)
1MHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BL24CM1A-NTRC 产品概述

一、简介

BL24CM1A-NTRC 是贝岭(BELLING)推出的一款高可靠性 I2C 接口串行 EEPROM,容量为 1Mbit,适用于对非易失性存储有较高寿命与长期保存要求的嵌入式系统。器件在工业级温度范围内工作,并以小尺寸 UDFN-8L(2×3) 封装满足空间受限场合的存储需求。

二、主要特性

  • 接口类型:标准 I2C,支持高达 1MHz 时钟频率(Fast-mode Plus)。
  • 存储容量:1Mbit(128 KByte)。
  • 工作电压:宽电压范围 1.7V ~ 5.5V,兼容 1.8V、3.3V 和 5V 系统。
  • 写周期时间(Tw):典型 5ms,写入完成可通过 ACK 轮询确认。
  • 写周期寿命:高达 4,000,000 次,适合频繁写入场景。
  • 数据保持(TDR):100 年,适合长期数据保存。
  • 工作温度:-40℃ ~ +85℃,满足工业级要求。
  • 封装:UDFN-8L (2×3) 小型化封装,利于高密度 PCB 设计。

三、电气与时序要点

器件支持 1MHz I2C 通讯,请根据总线长度和上拉电阻选择合适的上拉值以保证信号完整性。写操作后需等待典型 Tw = 5ms 的内部写入周期,建议使用 ACK 轮询来判断写入完成以提高总线效率。器件在 1.7V ~ 5.5V 范围内稳定工作,但在低电压条件下应注意 I2C 上拉电阻与时序裕度。

四、封装与机械信息

UDFN-8L (2×3) 封装尺寸小,适合空间受限应用。焊接时推荐在 PCB 布局上保留良好的焊盘和热量分布,以保证可靠的贴装质量与长期可靠性。

五、典型应用

  • 工业控制参数存储(校准数据、配置项)
  • 物联网终端与传感器节点的固件配置与日志保存
  • 医疗设备、仪表的长期设置保存
  • 消费电子与移动设备中的小容量非易失性存储

六、设计注意事项

  • 电源旁路:在 VCC 端近距放置 0.1μF 陶瓷旁路电容,抑制噪声并提升稳定性。
  • I2C 上拉:根据系统电压与总线负载选择合适上拉电阻,常见取值 2.2kΩ~10kΩ。
  • 写入管理:采用分页写入策略并结合 ACK 轮询判断写完成,避免在内部写周期中发起新的写请求。
  • 温度与寿命评估:在高温或频繁写入场景下,结合写周期寿命(4,000,000 次)与数据保持指标合理规划使用频率与备份策略。

七、选型优势

BL24CM1A-NTRC 以其宽电压兼容性、工业温度范围、超长数据保持与极高写周期寿命,为需要长期可靠存储与频繁写入的应用提供了稳健的解决方案。小尺寸 UDFN 封装也方便在受限空间中实现高密度设计。

如需进一步的时序图、电气参数曲线或参考电路图,请参照厂商完整数据手册以获得详细规格和推荐的 PCB 布局实践。

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