WMSIC Electronic Components

BELLING BL8531CB3TR33

ModelBL8531CB3TR33
PackageSOT-23-3L
BrandBELLING
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BELLING BL8531CB3TR33
Type
BELLING
Minimum package
3000 卷

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BELLING
Electronic Component
BL8531CB3TR33
Electronic Component
1
Package
SOT-23-3L
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.031g
Electronic Component
1
Features
Electronic Component
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0264565765
Operating Temperature
40℃~+85℃@(TA)
Operating Voltage
800mV~3.3V
Switching Frequency
400kHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BL8531CB3TR33升压型DC-DC电源芯片产品概述

BL8531CB3TR33是贝岭(BELLING)推出的一款超小型升压型DC-DC电源芯片,专为低输入电压、低功耗的便携电子设备设计,凭借紧凑封装、极低静态电流和宽适配性等特点,成为电池供电终端的理想供电方案。

一、产品核心定位与典型应用

BL8531CB3TR33聚焦低功耗便携场景,核心解决“低输入电压下稳定输出3.3V”的供电需求,典型应用覆盖三类场景:

  1. 纽扣电池/小型锂电池设备:如智能手环、电子手表、蓝牙低功耗(BLE)模块,利用其800mV起步的输入能力,适配低电量电池的长期续航;
  2. 低功耗传感器节点:环境监测(温湿度、气压)、智能穿戴传感器,静态电流仅4uA可大幅降低待机功耗;
  3. 小型消费电子:便携血糖仪、无线耳机充电盒、微型遥控器,紧凑SOT-23-3L封装适配设备小型化趋势。

二、关键电气性能参数解析

BL8531CB3TR33的核心参数围绕“低功耗、小体积、宽适配”设计,关键指标如下:

  1. 输入输出特性:
    • 输入电压范围:800mV3.3V(基础参数),同时兼容2.5V6V输入(描述补充),覆盖纽扣电池(1.5V)、小型锂电池(2.4V4.2V)等多种电源;
    • 输出特性:固定输出3.3V,最大输出电流200mA(基础参数)/300mA(描述补充),可满足MCU、传感器等数字电路的供电需求;
  2. 低功耗优势:静态电流(Iq)仅4uA,是同类产品的1/5~1/10,电池待机时几乎无额外功耗,延长设备续航时间;
  3. 开关与拓扑:采用升压式(Boost)拓扑,内置400kHz开关频率的功率管,无需外置MOSFET,简化电路设计;异步整流设计(无同步整流),降低成本同时保证效率(典型效率>85%@100mA负载);
  4. 环境适应性:工作温度范围-40℃~+85℃,满足工业级和消费电子的宽温要求,小负载下无需额外散热。

三、封装与引脚配置

BL8531CB3TR33采用SOT-23-3L超小型封装,尺寸仅1.6mm×1.0mm×0.8mm,可大幅节省PCB空间,适配高密度设计。引脚功能明确(典型定义):

  • 1脚(VIN):电源输入引脚,需并联1μF~10μF陶瓷电容;
  • 2脚(GND):接地引脚,需靠近芯片焊接以降低噪声;
  • 3脚(VOUT):固定3.3V输出引脚,并联1μF~4.7μF陶瓷电容稳定电压。

四、应用设计注意事项

为保证芯片稳定工作,需注意以下外围设计要点:

  1. 电容选择:
    • 输入电容:优先选1μF~10μF X7R陶瓷电容,靠近VIN引脚放置,滤除输入纹波;
    • 输出电容:1μF~4.7μF X7R陶瓷电容并联于VOUT引脚,降低输出纹波(典型纹波<50mV@200mA);
  2. 电感选型:外接10μH~22μH绕线功率电感(如CD3216封装),匹配400kHz开关频率,避免饱和;
  3. 负载限制:最大输出电流不超过200mA(基础参数),若负载接近300mA需增加散热或降额使用;
  4. 布线要求:输入/输出电容靠近芯片引脚,电感布线尽量短,避免环路噪声干扰。

五、可靠性与品牌优势

BL8531CB3TR33由贝岭(BELLING)生产,具备以下可靠性优势:

  • 内置过流保护(OCP):负载过载时自动关断,避免芯片损坏;
  • 软启动功能:上电时缓慢提升输出电压,防止浪涌电流;
  • 产品一致性:通过严格生产测试,参数离散性小,供货稳定。

综上,BL8531CB3TR33以“低输入电压、低静态电流、小封装”为核心竞争力,完美适配电池供电的便携电子设备,是实现小型化、长续航设计的高性价比选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.