WMSIC Electronic Components

BELLING BL55077

ModelBL55077
PackageLQFP-64(10x10)
BrandBELLING
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BELLING BL55077
Type
BELLING
Minimum package
1600 卷

Technical parameters

Electronic Component
1/3,1/2
Electronic Component
Electronic Component
Electronic Component
BELLING
Electronic Component
BL55077
Electronic Component
1
Package
LQFP-64(10x10)
Electronic Component
LCDDriver
Electronic Component
1.121g
Frequency
180kHz
Electronic Component
1
Features
Integrated; Built-in Oscillator
Electronic Component
BM0228055567
Operating Temperature
40℃~+75℃
Operating Voltage
2.5V~5.5V
Operating Current
25uA
Interface Type
2 Interface

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BL55077 产品概述

一、概述

BL55077 是贝岭(BELLING)推出的一款低功耗 LCD 驱动器,封装为 LQFP-64(10×10mm)。器件集成升压电路与内部振荡器,支持 40 段显示与 40×4 bit 的位配置(可驱动多达 160 个 LCD 段位),采用简洁的 2 线串行接口,适合对引脚和功耗有严格要求的便携及工业显示产品。

二、主要特性

  • 工作电压:2.5V ~ 5.5V,适配常见单节锂电与 3.3V/5V 系统。
  • 低功耗:典型工作电流 25 μA,静态电流仅 1.5 μA。
  • 偏压模式:支持 1/3 与 1/2 两档偏压选择,以适配不同对比度及段数需求。
  • 集成升压电路与内置振荡器,减少外部元件需求并简化系统设计。
  • 接口:2 线串行接口,降低 MCU 引脚占用并简化布线。
  • 工作频率:最高 180 kHz(器件内部时钟/驱动频率指标)。
  • 耗散功率 Pd:400 mW,适用于中等功率密度设计。
  • 工作温度范围:-40℃ ~ +75℃,适应工业级环境。

三、电气与显示能力

器件支持 40 段物理驱动并以 40×4 bit 方式组织显示位,适合小至中等规模字符、符号和图标型 LCD 面板。偏压可在 1/3 与 1/2 间切换以平衡对比度和电流消耗;集成升压器可在低电压供电时仍维持足够的 LCD 驱动电压,保证显示对比度。

四、封装与可靠性

LQFP-64(10×10mm)表面贴装封装,利于自动化生产与散热。封装引脚数足够实现灵活的控制与扩展,建议 PCB 设计时注意焊盘布局、地平面和热均匀性以确保长期可靠性与良好 EMI 表现。

五、典型应用

  • 智能家电与遥控器显示面板
  • 工业仪表与控制器的状态/数值显示
  • 医疗器械的低功耗字符显示
  • 便携式测量仪、手持设备、消费类电子的符号/数字 LCD 显示

六、设计与使用建议

  • 电源去耦:VDD 处应放置 0.1 μF 陶瓷电容靠近引脚,抑制噪声与瞬态。
  • LCD 布线:段/位线尽量短且并行,避免交叉干扰与大回路面积。
  • 偏压选择:根据面板容量和对比度要求选择 1/3 或 1/2,较大面板或高对比度场合建议 1/2。
  • 热与功耗:在高温或连续高负载时注意 Pd 限制,必要时评估散热或减小驱动占空。
  • 接口兼容:2 线串行接口便于 MCU 控制,但请参考具体时序要求,保证上/下拉与时钟完整性。
  • ESD 与保护:LCD 引脚易受静电影响,生产与维修时加强防静电保护,必要时在关键输入加入保护元件。

七、选型与注意事项

在最终选型前请核对目标 LCD 面板的段/位数量、面板电容与对比度需求,并参考 BL55077 详细数据手册中的引脚定义、时序、电平与典型应用电路。若系统对功耗或温漂有更苛刻要求,可与厂方或经销商确认器件的典型特性与可靠性验证记录。

如需更详细的电气参数、引脚图或参考电路图,请参考贝岭官方数据手册或联系供应商获取最新资料。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.