WMSIC Electronic Components

BELLING BL55072A

ModelBL55072A
PackageTSSOP-48-6.1mm
BrandBELLING
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Option 61876

Availability on request

Technical data

Product details

19 specifications

Core information

Product name
BELLING BL55072A
Type
BELLING
Minimum package
2500 卷

Technical parameters

Electronic Component
1/3,1/2
Electronic Component
Electronic Component
Electronic Component
BELLING
Electronic Component
BL55072A
Electronic Component
1
Package
TSSOP-48-6.1mm
Electronic Component
LCDDriver
Electronic Component
0.47g
Frequency
25.6kHz
Electronic Component
1/4
Electronic Component
1
Features
Integrated; Built-in Oscillator
Electronic Component
BM0228055571
Operating Temperature
40℃~+85℃
Operating Voltage
2.5V~5.5V
Operating Current
7.5uA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BL55072A 产品概述

一、产品概述

BL55072A 是贝岭(BELLING)推出的一款低功耗 LCD 驱动器,适用于小型到中型字符和图形 LCD 面板。器件支持 36×4 bit 显示配置,提供灵活的偏压选择(1/3、1/2)和 1/4 占空比驱动模式,工作电压范围宽(2.5V~5.5V),并采用 TSSOP-48-6.1mm 封装,便于空间受限的便携设备设计。

二、主要性能特点

  • 低功耗:工作电流典型值仅 7.5 μA,静态/待机电流 0.5 μA,适合电池供电或低功耗终端。
  • 稳定驱动:支持 1/4 占空比与 1/3/1/2 偏压配置,兼容多种 LCD 面板驱动要求。
  • 固定驱动频率:内部或外部时钟典型工作频率为 25.6 kHz,有利于减小闪烁与电磁干扰并优化显示稳定性。
  • 简洁接口:I2C 串行接口,便于与 MCU 集成、简化布线与软件驱动。
  • 宽温范围:工作温度 -40℃~+85℃,适应工业级及消费级环境。

三、电气参数与工作条件

  • 工作电压:2.5 V ~ 5.5 V,支持单节至多节电池及常见稳压器供电。
  • 工作电流:约 7.5 μA(典型,视具体工作模式与负载有所变化)。
  • 静态电流:约 0.5 μA(待机或静态显示条件)。
  • 驱动频率:25.6 kHz(典型),用于 LCD 驱动扫描与时基。
  • 显示配置:36×4 bit(总位数 144 bit),可驱动多段/多位显示模块。
  • 驱动参数:占空比 1/4;偏压支持 1/3 与 1/2 两种模式。
  • 温度范围:-40℃ ~ +85℃。

四、封装与机械特性

  • 封装形式:TSSOP-48,尺寸标为 6.1 mm(窄体小间距封装),利于高密度 PCB 布局与自动贴装加工。
  • 引脚分配一般包含电源、地、I2C(SDA/SCL)、LCD COM/SEG 驱动输出及控制/配置引脚(具体引脚图与焊盘信息请参考官方数据手册)。

五、应用场景与系统设计要点

  • 典型应用:便携仪器、手持终端、家用小家电显示、计量仪表、远程传感终端及需要低功耗显示的可穿戴设备等。
  • 设计要点:选择合适的偏压(1/3 或 1/2)与背光/对比度配合以达到最佳视觉效果;在电池组或系统电源边沿放置合适的去耦电容(如 0.1 μF 与 1 μF 并联),并在 I2C 线上使用上拉电阻以保证通信可靠性。

六、使用建议与注意事项

  • 对 LCD 模组兼容性:确认目标 LCD 面板的驱动占空比与偏压需求与 BL55072A 匹配;不同偏压会影响对比度与功耗。
  • EMI/噪声抑制:驱动频率在 25.6 kHz,布线与接地布局应注意减少噪声耦合到模拟电路或射频模块。
  • I2C 通信:遵循 I2C 时序规范,配置合理的上拉电阻,避免总线冲突;在系统上电/复位序列中确保器件初始化稳定。
  • 热与可靠性:在高温或长期工作场景,关注 PCB 散热与焊点可靠性,避免超出 -40℃~+85℃ 规格范围。

七、结论

BL55072A 以其超低静态与工作电流、灵活的偏压/占空比支持和宽电压、宽温范围,适合对功耗与空间有较高要求的 LCD 显示应用。采用标准 I2C 接口和 TSSOP-48 小封装,有助于简化系统集成与批量生产。如需深入的引脚定义、时序图和示例电路,请参阅贝岭官方数据手册或联系供应商获取完整技术资料。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.