WMSIC Electronic Components

Bencent BA301N

ModelBA301N
PackageSMD
BrandBencent
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Bencent BA301N
Type
BENCENT
Minimum package
2500

Technical parameters

Electronic Component
BENCENT
Electronic Component
BA301N
Electronic Component
1
Package
SMD
Electronic Component
2
Electronic Component
(GDT)
Electronic Component
±30%
Electronic Component
0.328g
Electronic Component
1
Electronic Component
BM0209242607
Operating Temperature
40℃~+90℃
Capacitor
1pF
Electronic Component
2500
Current
1kA
Voltage(Vdc)
300V
Voltage(Vimp)
800V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BA301N 气体放电管(GDT)产品概述

一、产品简介

BA301N 是 Bencent(槟城)推出的一款表面贴装型气体放电管(Gas Discharge Tube,GDT),封装尺寸为 1812(约 4.5 mm × 3.2 mm)。该器件为双极(2 极)气体放电保护元件,专为电力线、通信线、数据总线等需要防雷击和瞬态过电压保护的场合设计。BA301N 在高能脉冲冲击下能够迅速导通,将能量安全引入接地或旁路回路,从而保护后端电路元件。

二、主要电气参数

  • 脉冲放电电流(Iimp,peak):1 kA(单次冲击能力,典型雷电冲击保护能力)
  • 直流击穿电压(Vdc):300 V(在直流施加下器件维持不导通的额定电压)
  • 冲击击穿电压(Vimp):800 V(脉冲冲击条件下的击穿参考电压)
  • 极数:2(双极电极结构)
  • 精度(击穿电压容差):±30%(器件制造与工艺允许的击穿电压偏差范围)
  • 极间电容:1 pF(典型值,适合对信号完整性要求较高的线路)
  • 工作温度范围:-40 ℃ ~ +90 ℃
  • 封装型式:SMD 1812
  • 品牌:Bencent(槟城)

三、结构与封装

BA301N 采用 SMD 1812 封装,体积小、便于自动贴片和回流焊接。双极电极结构使其可用于两线之间或线对接地的直接放电保护。典型封装尺寸(1812)在 PCB 布局上占用面积小,适合紧凑型设计与现代化电子设备的自动化生产。

四、关键特性

  • 高脉冲能量承受能力:1 kA 脉冲放电能力满足常见雷电浪涌和瞬态过电压的能量释放需求。
  • 低静态隔离电容:约 1 pF 的极间电容使其对高速信号线影响极小,适合数据通信与高速接口的线路保护。
  • 宽工作温度:-40 ℃ 至 +90 ℃ 适应一般工业与户外环境应用。
  • 高击穿耐受:Vdc 与 Vimp 指标保证在规定电压下器件保持隔离或在骤升电压时可靠触发放电。
  • 表面贴装:便于自动化装配、提升生产效率和焊接可靠性。

五、典型应用场景

  • 电力系统过电压保护(低压配电柜、控制回路入口)
  • 通信接口保护(电话线、DSL、以太网接口、光纤收发端口的电气侧保护)
  • 安防与监控设备(摄像头电源线与信号线雷击保护)
  • 工业控制系统(PLC 输入/输出、现场总线保护)
  • 电源入口与浪涌抑制模块(与其他保护器件组合使用)

六、设计与安装建议

  • 放置位置:建议将 GDT 尽量靠近入线端或接口端放置,缩短到被保护设备之间的导线长度,以降低串联感抗与阻抗不匹配导致的残压。
  • 配合使用:GDT 在击穿后电压接近零但维持一段时间的放电过程,常与快速响应的固态器件(如 TVS)并联或串联配合使用:TVS 先吸收小幅瞬变,GDT 处理大能量冲击,实现更完善的多级保护。
  • 接地处理:GDT 性能依赖良好的接地回路。确保接地线短且阻抗低,避免放电能量回流对周边电路造成二次损伤。
  • 焊接工艺:按照 SMD 回流焊工艺规范布置,避免过度热应力。建议参考厂商的回流温度曲线和焊接指南。
  • 清洗与维护:贴片后避免强烈机械冲击。对清洗工艺敏感性按厂方建议进行(如需无残留溶剂清洗,确认器件受影响情况)。

七、选型与配套方案提示

  • 若系统输出或通信线路电压高于直流击穿电压(300 V),应考虑使用更高 Vdc 等级或并用限压器件以防误触发。
  • 对于要求更低电容量的高速数据信号,可以 1 pF 的极间电容作为选择依据;但对极高速(几百 MHz 以上)仍需在系统级进行信号完整性评估。
  • 在雷击频繁或能量更高场合,选择具有更高脉冲电流能力的型号或并联多管分担能量。

八、可靠性与环境适应

BA301N 设计满足工业级工作温度要求,适合室内及受控户外环境的浪涌保护需求。器件在反复雷击条件下的寿命和击穿参数会受放电能量与次数影响,建议在关键应用中进行过压试验与寿命验证,并依据实际运行情况定期检查或更换保护元件。

总结:BA301N 结合了较高的脉冲放电能力、低极间电容和 SMD 小体积特性,是保护低压电力与高速通信线路免受瞬态过电压和雷击冲击的实用方案。选型与布局时应关注直流击穿电压、冲击耐受等级以及与系统接地和其它保护器件的配合。若有具体电路或测试场景,提供详细参数可获得更针对性的应用建议。

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