WMSIC Electronic Components

Bencent BC091N-H BC091N

ModelBC091N-H
PackageSMD
BrandBencent
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Bencent BC091N-H
Type
BENCENT
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BENCENT
Electronic Component
BC091N-H
Electronic Component
1
Package
SMD
Electronic Component
2
Electronic Component
(GDT)
Electronic Component
±30%
Electronic Component
0.327g
Electronic Component
1
Electronic Component
BM0264871113
Operating Temperature
40℃~+125℃
Capacitor
0.5pF
Electronic Component
Electronic Component
Electronic Component
2500
Current
3kA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BC091N-H 气体放电管(GDT)产品概述

一、产品定位与核心功能

BC091N-H是Bencent(槟城)推出的SMD封装气体放电管,属于3kA浪涌防护系列,专为电子设备的电源端口、信号接口提供雷电冲击、静电放电(ESD)及瞬态过压的可靠防护。其兼具小尺寸、低电容、宽温适应等特性,适配工业、通信、消费电子等多领域的过压防护需求,可有效避免后端电路因过压损坏。

二、核心电气参数详解

BC091N-H的关键参数围绕“防护可靠性”与“信号兼容性”设计,具体如下:

  • 直流击穿电压(Vdc):90V±30%,实际击穿范围约63V~117V,适配12V/24V等低压电路,避免误触发且确保过压时快速导通;
  • 脉冲放电电流(8/20μs波形):3kA,具备中等强度浪涌承受能力,可抑制常见雷电感应过压及电源瞬态干扰;
  • 极间电容:0.5pF(典型值),低电容特性对高速信号传输影响极小,适配USB3.0、HDMI、以太网等高频接口;
  • 冲击击穿电压(Vimp):550V(1.2/50μs波形),瞬态高压下快速响应,避免击穿延迟;
  • 工作温度范围:-40℃~+125℃,覆盖工业级、车载级环境要求,极端温度下仍稳定工作;
  • 极数:2(双极),无正负极性,安装无需区分方向。

三、封装与物理尺寸

采用表面贴装(SMD)封装,尺寸为4.5mm×3.2mm(长×宽),体积小巧:

  • 适配小型化、高密度PCB设计(如智能家居设备、车载终端);
  • 支持自动化贴装工艺,提升生产效率,降低人工成本;
  • 封装结构抗机械应力能力强,可满足批量生产的可靠性要求。

四、关键特性优势

  1. 高浪涌防护能力:3kA脉冲放电电流(8/20μs),可应对户外设备的雷电感应过压、工业电源的瞬态波动;
  2. 低电容无信号干扰:0.5pF极间电容,在1GHz以上高速信号传输中,信号衰减、相位偏移可忽略,不影响设备性能;
  3. 宽温稳定可靠:-40℃~+125℃范围,适配北方低温、南方高温及工业现场的极端环境;
  4. 精准击穿特性:±30%击穿电压精度,可根据电路工作电压灵活匹配,避免防护失效或误触发;
  5. 易集成与兼容:SMD封装可与TVS二极管、压敏电阻(MOV)并联,形成“多级防护”,提升整体可靠性。

五、典型应用场景

BC091N-H的特性使其适配多领域过压防护,典型场景包括:

  1. 通信领域:基站收发信机、无线路由器、交换机的电源端口及以太网接口防护;
  2. 工业控制:PLC、传感器模块、变频器的电源及信号输入端口防护;
  3. 消费电子:液晶显示器、机顶盒、智能家居设备的HDMI、USB接口防护;
  4. 车载电子:车载导航、车联网终端、CAN总线接口的过压防护;
  5. 户外设备:安防摄像头、无线AP、太阳能供电设备的电源端口防护。

六、选型与应用注意事项

  1. 选型匹配:需根据被保护电路的工作电压(如12V/24V系统)选择90V击穿电压的GDT,避免击穿电压过高导致防护延迟;
  2. 安装规范:焊接温度≤260℃(时间≤3s),避免高温损坏器件;安装时避免机械应力,防止封装开裂;
  3. 多级防护配合:建议与TVS二极管并联(GDT泄放大电流、TVS抑制尖峰电压),形成互补防护;
  4. 极性要求:双极器件无正负极,安装无需区分方向,简化设计流程。

总结

BC091N-H作为一款高性能SMD气体放电管,凭借3kA浪涌承受能力、0.5pF低电容、宽温适应等核心优势,可有效解决电子设备的过压防护问题,是工业、通信、消费电子等行业的可靠选择。其小尺寸与易集成特性,更适配当前电子设备的小型化、高密度设计趋势。

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