WMSIC Electronic Components

Bencent BV-D505ZC

ModelBV-D505ZC
PackageSOD-523
BrandBencent
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Bencent BV-D505ZC
Type
BENCENT
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BENCENT
Electronic Component
BV-D505ZC
Electronic Component
1
Package
SOD-523
Type
TVS
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.233g
Electronic Component
1
Cj- Capacitor
15pF
Electronic Component
BM0264871108
Operating Temperature
55℃~+150℃
Voltage
18.6V
Electronic Component
IEC 61000-4-5;IEC 61000-4-2
Current(Ir)
1uA
Voltage(VBR)
5.6V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BV-D505ZC 产品概述

一、产品简介

BV-D505ZC 是 Bencent(槟城)推出的一款低电容单向 TVS(二极管)器件,专为 5V 供电系统的静电(ESD)与浪涌(Surge)保护设计。器件封装为 SOD-523,体积小、适合空间受限的移动设备与消费类电子电路板布局。符合 IEC 61000-4-2(静电放电)与 IEC 61000-4-5(浪涌)等级要求。

二、主要电气参数

  • 反向截止电压 Vrwm:5V(适用于 5V 系统)
  • 击穿电压 VBR:5.6V(典型)
  • 钳位电压(Clamping):18.6V(Ipp 条件下)
  • 峰值脉冲电流 Ipp:10A @ 8/20µs
  • 峰值脉冲功率 Ppp:200W @ 8/20µs
  • 反向漏电流 Ir:1µA(典型,低泄漏)
  • 结电容 Cj:15pF(低电容,适合一般数据信号)
  • 工作温度范围:-55℃ ~ +150℃

三、典型特性与优势

  • 高能量吸收能力:200W(8/20µs)脉冲功率和 10A 峰值脉冲电流,可承受常见浪涌事件。
  • 低钳位电压:在冲击时将电压钳制在 18.6V,减少下游器件受损风险。
  • 低漏电与低结电容:1µA 漏电和 15pF 电容,保证对微弱信号影响小,功耗低。
  • 紧凑封装:SOD-523 适合高密度 PCB 设计与成本敏感应用。
  • 工业级温度范围:-55℃ ~ +150℃,适用于多种环境条件下稳定工作。

四、应用场景

  • USB(尤其 USB2.0/低速信号)、UART、I2C、SPI 等接口防护
  • 手机、平板、便携式终端的外部接口保护
  • 工业自动化与仪表的信号线、控制线保护(非长期高功率供电场合)
  • 消费类电子、物联网设备、充电/通信接口的浪涌与静电防护

注意:对于高速差分接口(如 USB3.0/HDMI/PCIe)应考虑更低电容器件以避免信号完整性问题。

五、设计与布局建议

  • 将 TVS 尽可能靠近受保护的连接器或接口放置,最短回路与地线。
  • 对地走线要粗短,推荐单点接地或低阻抗回流路径以降低钳位电压。
  • 在需要时与串联电阻、共模电感或滤波器配合使用以提高整体抗扰度。
  • 该器件为瞬态保护元件,非用于长期稳态浪涌承载;连续过电流或过热会损坏器件。

六、包装与可靠性

  • 封装:SOD-523,适合自动贴装(SMT)。
  • 推荐在符合厂商回流焊曲线下焊接,避免超过最大回流温度与时间。
  • 出厂前已通过 IEC 61000-4-2/4-5 测试验证,适用于一般商业与工业级抗扰需求。

七、物料与选型提示

  • 型号:BV-D505ZC;品牌:Bencent(槟城)。
  • 在选择时确认 Vrwm 与系统工作电压匹配(本器件适用于 5V 及以下保护场合)。
  • 如需更高能量吸收或更低钳位电压,请与供应商交流其他系列或并联方案。

BV-D505ZC 提供了小封装下针对 5V 系统的可靠瞬态保护解决方案,适合空间受限且需兼顾信号完整性的多种应用。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.