WMSIC Electronic Components

Bencent BV-FK05U4CA

ModelBV-FK05U4CA
PackageSMD_5.0X5.4
BrandBencent
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Bencent BV-FK05U4CA
Type
BENCENT
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BENCENT
Electronic Component
BV-FK05U4CA
Electronic Component
1
Package
SMD_5.0X5.4
Electronic Component
Electronic Component
Type
TVS
Electronic Component
0.03g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
0.35pF;0.6pF
Voltage
6V
Electronic Component
BM0086004477
Operating Temperature
40℃~+125℃
Voltage
15V
Electronic Component
IEC 61000-4-4;IEC 61000-4-5;IEC 61000-4-2

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BV-FK05U4CA TVS瞬态抑制二极管产品概述

一、产品定位与核心用途

BV-FK05U4CA是Bencent(槟城)品牌推出的4路单向TVS瞬态抑制二极管,属于静电/浪涌保护类核心器件,专注于低电压敏感电子电路的瞬态过压防护。其核心作用是在电路遭遇静电放电(ESD)、电源浪涌、接口插拔脉冲等瞬态冲击时,快速导通并将电压钳位在安全范围,避免后端敏感元件(如MCU、传感器、通信芯片)因过压损坏,大幅提升设备可靠性与使用寿命。

二、关键性能参数深度解析

该器件的参数针对低电压应用场景优化,核心参数及实际意义如下:

  1. 反向截止电压(Vrwm=5V):电路正常工作时的反向偏置上限,若系统工作电压≤5V(如3.3V、5V电源),器件保持截止状态,不干扰信号传输或供电。
  2. 击穿电压(6V):反向偏置下器件从截止转为导通的阈值,确保过压时快速响应(响应时间<1ns),避免电压持续上升。
  3. 峰值脉冲电流(Ipp=3A@8/20μs):符合IEC 61000-4-5浪涌标准,可承受3A瞬态浪涌冲击,覆盖接口插拔、电源波动等常见脉冲强度。
  4. 最大钳位电压(15V):瞬态过压时将电路电压钳至15V以内,远低于多数敏感元件的击穿阈值(如MCU耐压多在10-20V区间),有效保护后端电路。
  5. 低电容(0.6pF):4路通道电容均控制在0.6pF左右,对高频信号(蓝牙、WiFi、USB3.0)衰减影响极小,适合射频及高速通信接口。
  6. 4路单向结构:集成4个独立单向TVS通道,可同时防护多引脚接口(如Type-C、传感器阵列),减少外围元件与PCB空间占用。

三、封装与结构特点

BV-FK05U4CA采用DFN2510-10封装(尺寸约2.5mm×1.0mm),具备以下优势:

  • 小型化适配:超小体积适合智能手机、智能穿戴、物联网节点等对空间要求严格的设备。
  • 自动化贴装:贴片式设计兼容常规SMT生产线,焊接效率高,适合批量生产。
  • 集成度高:单封装集成4路防护通道,无需并联多个TVS,简化电路设计与布线。
  • 散热优:DFN封装热阻低,可快速散发明态脉冲热量,避免器件过热损坏。

四、典型应用场景

该器件的低电压、低电容、多通道特性,适配多种场景:

  1. 消费电子:智能手机Type-C接口(电源+数据引脚防护)、智能手表充电口,吸收插拔静电与浪涌。
  2. 物联网设备:温湿度传感器、运动传感器节点,保护低功耗MCU免受环境静电冲击。
  3. 通信模块:蓝牙、WiFi模块的天线与数据接口,低电容不影响射频信号传输。
  4. 工业控制:小型PLC、远程IO模块的输入口,防护工业现场浪涌干扰。
  5. 车载辅助电路:中控屏USB接口、胎压传感器节点(需结合整车EMC验证)。

五、选型与使用注意事项

  1. 电压匹配:电路正常电压≤Vrwm(5V),后端元件耐压≥钳位电压(15V),否则需多级防护。
  2. 焊接规范:回流焊峰值温度≤260℃,避免过温损坏;焊接后检查引脚虚焊。
  3. 通道分配:4路单向通道可按接口引脚(电源、数据、地)灵活分配,确保全防护。
  4. 静电防护:存储/运输用防静电包装,焊接时佩戴防静电手环。

该器件凭借高集成度、低电容、强防护能力,成为低电压敏感电路瞬态防护的高性价比选择,广泛适配便携电子、物联网、工业控制等领域。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.