Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Bencent BV-SMBJ15CAH
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Bencent BV-SMBJ15CAH
- Type
- BENCENT
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- BENCENT
- Electronic Component
- BV-SMBJ15CAH
- Electronic Component
- 1
- Package
- SMB(DO-214AA)
- Electronic Component
- Electronic Component
- Type
- TVS
- Electronic Component
- ESD and Surge Protection (TVS / ESD)
- Electronic Component
- 0.169g
- Electronic Component
- 1
- Voltage
- 16.7V
- Electronic Component
- BM0265085527
- Operating Temperature
- 55℃~+150℃
- Electronic Component
- IEC 61000-4-2
- Current(Ir)
- 1uA
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BV-SMBJ15CAH 产品概述
一、产品概述
BV-SMBJ15CAH 为 Bencent(槟城) 出品的双向瞬态电压抑制二极管（TVS），封装为 SMB (DO-214AA)。器件稳态反向截止电压（Vrwm）为 15V，典型击穿电压（Vbr）约 16.7V，峰值脉冲放电能力为 500A（8/20µs 波形），静态反向漏电流（Ir）仅 1µA，工作温度范围 -55℃ 至 +150℃，符合 IEC 61000-4-2 静电放电防护等级，专为对抗电源瞬态过压、浪涌和静电放电而设计。
二、主要特点
- 双向抑制：对称响应正、负瞬变脉冲，适合交流或双向信号线路保护。
- 高脉冲承受能力：500A@8/20µs，能承受工业级浪涌冲击。
- 低漏电流：Ir ≈ 1µA，适合对静态功耗敏感的应用。
- 宽温区：-55℃～+150℃，适应苛刻环境。
- 标准封装：SMB (DO-214AA)，便于自动贴装与波峰/回流焊工艺。
三、典型应用
- 电源线、车载辅助电路的瞬变保护（需按车规要求验证）。
- 工业控制设备、PLC、伺服驱动器的输入输出端浪涌防护。
- 通信设备、接口保护（如信号总线、继电器驱动）。
- 消费电子与测试测量设备的 ESD/浪涌防护。
四、设计与使用建议
- 典型接法：并联连接于被保护回路两端，双向器件无需极性区分。
- 热管理：大电流脉冲时发热显著，建议在 PCB 上留大量散热铜箔并靠近接地点布线以降低热阻。
- 焊接工艺：兼容标准回流焊，避免长期高温储存及不当焊接造成应力裂纹。
- 选型提示：若系统需更低钳位电压或更高峰值脉冲能力，请参考器件的钳位电压曲线和能量吸收能力，或选用更高规格型号。
五、可靠性与合规
BV-SMBJ15CAH 针对 IEC 61000-4-2 标准提供 ESD 防护性能，器件在规范温度范围内稳定工作，适合工业级和商用级防护设计。使用时请结合系统级浪涌测试验证整体防护效果。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
