WMSIC Electronic Components

Bencent B3D090M-C B3D090M

ModelB3D090M-C
PackageSMD
BrandBencent
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Bencent B3D090M-C
Type
BENCENT
Minimum package
1000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BENCENT
Electronic Component
B3D090M-C
Electronic Component
1
Electronic Component
5mm
Package
SMD
Electronic Component
3
Electronic Component
(GDT)
Electronic Component
1.26g
Electronic Component
7.8mm
Electronic Component
6mm
Electronic Component
1
Electronic Component
BM0009252240
Operating Temperature
40℃~+90℃
Capacitor
1.5pF
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

B3D090M-C 产品概述

一、产品简介

B3D090M-C 是 Bencent(槟城)推出的一款陶瓷封装贴片式气体放电管(GDT),为三端(3端)防护器件,面向需要大能量冲击抑制且对线路一致性与低插入电容有要求的通信与电力接口。器件标称脉冲放电能力可达 10kA(8/20µs),直流击穿电压(Vdc)在 72V~108V 范围内,适用于中高电压工况下的浪涌保护。

二、主要性能特点

  • 高脉冲放电能力:8/20µs 峰值可达 10kA,能承受强雷击与开关冲击能量。
  • 三端结构:两线对地或两线互相及对地的多模态防护,适合对称线路和差分信号保护。
  • 低极间电容:约 1.5pF,适用于对信号完整性有要求的高速数据线路(如通讯接口、PoE 对等)。
  • 宽工作温度:-40℃ 至 +90℃,满足工业级环境要求。
  • 紧凑封装:SMD 贴片安装,外形尺寸 7.8mm × 5mm × 6mm,方便自动化贴装与批量生产。
  • 陶瓷气体管结构:稳定的击穿特性与良好的耐久性,长寿命、低漏电。

三、典型应用场景

  • 通信基站、光纤收发器、DSL、以太网/PoE 端口的防雷与浪涌保护。
  • 工业控制与数据采集系统的输入/输出接口防护。
  • 智能电表、配电监控、楼宇自控等需要抗雷击的线缆接口。
  • 与 TVS 等快速器件配合构建复合防护方案:GDT 吸收大能量冲击,TVS 处理快速暂态并降低触发电压。

四、主要电气与机械参数

  • 脉冲放电电流(Ipp): 10kA(常按 8/20µs 波形)
  • 直流击穿电压(Vdc): 72V ~ 108V
  • 冲击击穿电压(Vimp): 450V
  • 极间电容:约 1.5pF
  • 极数:3(三端)
  • 尺寸:长度 7.8mm × 宽度 5mm × 高度 6mm
  • 工作温度:-40℃ ~ +90℃
  • 封装形式:SMD,陶瓷封装,适合回流焊工艺

五、使用与安装建议

  • 推荐在 PCB 设计时尽量缩短被保护线与接地/参考平面的走线长度,以降低感抗、提高放电效率。
  • 三端器件的接线方式应根据实际线路拓扑选择:中心地端或中性端需可靠接地。
  • 对于需要兼顾高速信号的场合,可在 GDT 前并联 TVS 或串联小阻抗元件,形成“先快后大”保护策略,TVS 负责瞬态限压,GDT 负责大能量吸收。
  • 采用标准回流焊曲线进行贴片焊接,避免超温或长时间高温暴露以免影响内部填充气体与封装可靠性。
  • 存储与运输时注意防潮、防机械冲击。

六、包装与订购信息

  • 型号:B3D090M-C
  • 品牌:Bencent(槟城)
  • 封装:SMD,适合自动化贴装
  • 订购时请确认所需出货包装(卷带/盘带等)与批量测试要求,并在系统设计中预留足够的接地与过流通路以发挥器件保护性能。

B3D090M-C 以其高能量处理能力、低电容和三端设计,适合工业、通信与电力接口等对浪涌防护要求严格的场合,是构建可靠防护方案的重要器件。若需详细的电气曲线、典型浪涌测试报告或封装尺寸图,请联系供应商索取完整数据手册。

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