Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
HSMS-C170是由Broadcom Limited制造的一款高性能红色散射片式表面贴装LED。该产品在业界以其小巧的设计和卓越的性能而受到广泛关注,适用于各种照明和指示应用。由于其极佳的光学特性和电学参数,HSMS-C170理想用于消费电子、汽车、通信设备以及各类工业设备中。
HSMS-C170采用0805(2012公制)封装,尺寸为2.00mm长 x 1.25mm宽,厚度最大仅为0.80mm,便于在有限的空间内进行高密度布置。其红色发光来源于主波长为626nm的半导体材料,峰值波长为630nm,能够提供良好的视觉效果,同时其透镜颜色为白色,透镜透明度为散射,能够有效保证光线的均匀分布。
该LED的光强度达到10mcd,光束的视角为170度,确保其在各种安装环境中都能提供广泛的可见度。得益于其标准配置,HSMS-C170在灯光设计中能够轻松适应各种角度与距离,使其成为指示灯、背景光或者装饰照明的理想选择。
在电气特性方面,HSMS-C170的正向电压(Vf)典型值为2.1V,工作电流为20mA。这一电压和电流的组合使得其在低功耗应用中尤为突出,能够有效降低能耗同时保证亮度。特别是对于便携设备来说,其高效能直接转化为更长的电池续航时间。
HSMS-C170采用表面贴装型(SMD)安装方式,这提高了生产效率并降低了组装成本。该LED可广泛应用于各种行业领域,包括但不限于:
HSMS-C170是Broadcom领先技术的体现,凭借其卓越的光学性能和紧凑的设计,为工程师提供了灵活的设计空间。无论是在日常消费产品中,还是在专业工业设备中,该LED组件都能满足高标准的技术要求。随着智能设备和物联网的发展,对高性能LED组件的需求持续增长,HSMS-C170无疑是一款值得考虑的优质产品,为各种应用带来更多可能性。
该产品不仅优雅地结合了美观与功能,更以其可靠性和经济性赢得了用户的青睐。选择HSMS-C170,您将体验到Broadcom在LED技术领域的业内领先地位。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products