WMSIC Electronic Components

Broadcom HSMS-C170

ModelHSMS-C170
Package0805
BrandBroadcom
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
Broadcom HSMS-C170
Type
BROADCOM
Unit
Electronic Component
Minimum package
4000 圆盘

Technical parameters

Power
52mW
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
BROADCOM
Electronic Component
HSMS-C170
Electronic Component
1
Package
0805
Electronic Component
LEDDiode / LED
Electronic Component
0g
Electronic Component
1
LED
Electronic Component
Electronic Component
BM0084952468
Current
20mA
(Vf)
2.1V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:HSMS-C170红色散射片式LED

产品介绍

HSMS-C170是由Broadcom Limited制造的一款高性能红色散射片式表面贴装LED。该产品在业界以其小巧的设计和卓越的性能而受到广泛关注,适用于各种照明和指示应用。由于其极佳的光学特性和电学参数,HSMS-C170理想用于消费电子、汽车、通信设备以及各类工业设备中。

基础参数

HSMS-C170采用0805(2012公制)封装,尺寸为2.00mm长 x 1.25mm宽,厚度最大仅为0.80mm,便于在有限的空间内进行高密度布置。其红色发光来源于主波长为626nm的半导体材料,峰值波长为630nm,能够提供良好的视觉效果,同时其透镜颜色为白色,透镜透明度为散射,能够有效保证光线的均匀分布。

光学特性

该LED的光强度达到10mcd,光束的视角为170度,确保其在各种安装环境中都能提供广泛的可见度。得益于其标准配置,HSMS-C170在灯光设计中能够轻松适应各种角度与距离,使其成为指示灯、背景光或者装饰照明的理想选择。

电学参数

在电气特性方面,HSMS-C170的正向电压(Vf)典型值为2.1V,工作电流为20mA。这一电压和电流的组合使得其在低功耗应用中尤为突出,能够有效降低能耗同时保证亮度。特别是对于便携设备来说,其高效能直接转化为更长的电池续航时间。

安装与应用

HSMS-C170采用表面贴装型(SMD)安装方式,这提高了生产效率并降低了组装成本。该LED可广泛应用于各种行业领域,包括但不限于:

  • 消费电子:用于手机、平板电脑、电视等产品的指示灯和背光源。
  • 汽车:作为仪表盘、按钮和开关的状态指示灯。
  • 工业设备:在机器和设备的状态指示中发挥作用。
  • 通信设备:用于网络设备中的状态指示,告诉用户设备的运行状态。

结论

HSMS-C170是Broadcom领先技术的体现,凭借其卓越的光学性能和紧凑的设计,为工程师提供了灵活的设计空间。无论是在日常消费产品中,还是在专业工业设备中,该LED组件都能满足高标准的技术要求。随着智能设备和物联网的发展,对高性能LED组件的需求持续增长,HSMS-C170无疑是一款值得考虑的优质产品,为各种应用带来更多可能性。

该产品不仅优雅地结合了美观与功能,更以其可靠性和经济性赢得了用户的青睐。选择HSMS-C170,您将体验到Broadcom在LED技术领域的业内领先地位。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.