WMSIC Electronic Components

BAT WIRELESS BW2.4MNS3216

ModelBW2.4MNS3216
PackageSMD
BrandBAT WIRELESS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BAT WIRELESS BW2.4MNS3216
Type
BAT WIRELESS
Minimum package
5000 圆盘

Technical parameters

Power
50W
Electronic Component
Electronic Component
Electronic Component
BAT WIRELESS
Electronic Component
BW2.4MNS3216
Electronic Component
1.85dBi
Electronic Component
1
Electronic Component
1.6mm
Package
SMD
Electronic Component
100MHz
Electronic Component
Antenna
Electronic Component
0.03g
Electronic Component
3.2mm
Electronic Component
50Ω
Electronic Component
0.6mm
Electronic Component
1
Frequency
2.45GHz

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BW2.4MNS3216 贴片天线产品概述

BW2.4MNS3216是BAT WIRELESS(蝙蝠无线) 推出的一款超小型SMD贴片天线,专为2.4GHz ISM频段无线通信设计,具备紧凑尺寸、宽温适应、稳定性能等核心优势,可满足各类小型化无线设备的射频信号发射与接收需求。

一、产品定位与核心应用

该天线针对2.4GHz频段主流无线协议(蓝牙4.0/5.0、Wi-Fi 2.4G、ZigBee、Thread等)优化,聚焦「小型化无线设备集成」痛点——解决传统外接天线体积大、易损坏的问题,适用于对空间要求苛刻的终端产品,是IoT终端、可穿戴设备、工业传感器等场景的理想选择。

二、关键性能参数解析

BW2.4MNS3216的参数设计精准匹配2.4GHz频段应用需求,核心指标如下:

  • 频率特性:中心频率2.45GHz,带宽100MHz(覆盖2.4~2.5GHz),兼容主流无线协议的工作信道,无需额外频点调整;
  • 信号性能:增益1.85dBi,在近距离(10~30m)场景下实现稳定覆盖,避免过高增益导致的信号干扰,适合室内/小型通信场景;
  • 电气匹配:阻抗50Ω,与通用射频前端(蓝牙芯片、Wi-Fi模块等)完美匹配,反射损耗< -15dB,提升信号传输效率;
  • 功率耐受:最大50W功率,满足中功率无线设备的发射需求,避免功率过载导致的天线失效;
  • 环境适应:工作温度-45℃~+85℃,覆盖工业级温度范围,可在极端环境(低温户外、高温车间)稳定工作;
  • 尺寸规格:3.2mm(长)×1.6mm(宽)×0.6mm(高),属于超小型SMD封装,可直接集成在设备主板上,不影响外观与体积。

三、设计特点与优势

  1. 超小型SMD封装:采用表面贴装设计,支持自动化回流焊,与其他电子元件同步生产,简化工艺流程,降低制造成本;
  2. 抗振动结构:平面贴片无外接导线,抗振动性能优异,适合移动设备(如可穿戴、手持终端)或工业振动场景;
  3. 宽温可靠性:经过50次高低温循环测试(-45℃→+85℃),性能波动<1dB,满足工业级应用的稳定性要求;
  4. 一致性好:BAT WIRELESS的成熟天线工艺保证批量产品的频率、增益偏差<±0.5%,避免终端设备信号差异。

四、封装与可靠性验证

  • 封装类型:SMD(符合IPC-J-STD-001标准),引脚间距适配通用贴片机,回流焊温度曲线兼容180~220℃常规工艺;
  • 可靠性测试:通过振动测试(10~2000Hz,加速度2g)、功率老化测试(50W连续工作100小时)、盐雾测试(48小时),保证实际应用中的耐用性;
  • 环保认证:符合RoHS 2.0标准,无铅无镉,满足绿色电子生产要求。

五、典型应用场景

  1. 智能家居终端:智能门锁、温湿度传感器、智能插座,集成后实现蓝牙/ZigBee无线通信;
  2. 可穿戴设备:智能手环、智能手表、健康监测仪,满足小型化与低功耗需求;
  3. 工业IoT传感器:工业温度传感器、压力传感器、位置传感器,适应工业环境的宽温与振动;
  4. 小型蓝牙/Wi-Fi设备:蓝牙音箱、迷你无线路由器、Wi-Fi模块,提升信号覆盖稳定性;
  5. 医疗小型设备:便携式血氧仪、家用血压计,保证信号传输的可靠性。

BW2.4MNS3216凭借紧凑尺寸、稳定性能与宽温适应能力,成为2.4GHz频段小型化无线设备的核心天线选择,可有效解决设备集成中的空间限制问题,提升无线通信质量。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.