WMSIC Electronic Components

BAT WIRELESS BW0019AG-.5W1.5H3.5 BW0019AG

ModelBW0019AG-L3.5W1.5H3.5
BrandBAT WIRELESS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

15 specifications

Core information

Product name
BAT WIRELESS BW0019AG-L3.5W1.5H3.5
Type
BAT WIRELESS
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BAT WIRELESS
Electronic Component
BW0019AG-L3.5W1.5H3.5
Electronic Component
1
Electronic Component
3.5x1.5x3.5mm
Electronic Component
SUS 301
Electronic Component
Other Module
Electronic Component
0.089g
Electronic Component
1
Electronic Component
BM0264240606
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BW0019AG-L3.5W1.5H3.5 产品概述

一、产品简介

BW0019AG-L3.5W1.5H3.5 是 BAT WIRELESS(蝙蝠无线)系列中的精密微型不锈钢结构件,公称外形尺寸为 3.5 × 1.5 × 3.5 mm(长 × 宽 × 高)。本件以 SUS 301 不锈钢为基材制造,适用于对耐蚀性、机械强度与尺寸稳定性有较高要求的小型电子结构或机电组件。封装信息按客户需求确定(当前标注为“–”)。

二、主要特性

  • 紧凑尺寸:3.5 × 1.5 × 3.5 mm 的微型化设计,便于在高密度装配空间中使用。
  • 优良力学性能:SUS 301 提供较高的屈服强度和弹性极限,适合需要一定支持或弹性回复的应用。
  • 抗腐蚀能力:不锈钢材质天然抗氧化抗腐蚀,延长器件在潮湿或轻度化学环境下的使用寿命。
  • 工艺兼容性强:可进行冲压、冲弯、激光切割、微焊及后续表面处理(钝化、电解抛光或镀层)工艺。
  • 可定制化:可根据装配要求调整加工公差、表面处理与出货包装。

三、机械与材料规格

  • 尺寸(公称):L 3.5 mm × W 1.5 mm × H 3.5 mm。
  • 基材:不锈钢 SUS 301(标准化学成分与力学性质,详见材料证书)。
  • 加工公差:依据加工工艺与批量不同可提供不同公差等级,常见微型件可控制在 ±0.02–0.1 mm 范围;具体公差需在订单中确认。
  • 温度特性:SUS 301 在常用电子产品温度范围内具有良好稳定性;具体工作温度范围建议按实际工况与热处理状态评估。

四、工艺与表面处理

  • 常用制造工艺:精密冲压/冲裁、微折弯、激光切割、微焊接或钎焊。
  • 表面处理建议:酸洗钝化(提高耐蚀性)、电解抛光(改善外观与去应力)、或根据需要进行镀镍/镀金以改善导电接触性能或兼顾装饰性。
  • 清洁与包装:出厂前建议去油、超声清洗并按照电子元件洁净级别包装,避免表面污染影响后续装配或焊接。

五、典型应用场景

  • 无线通信终端与模块的机械支撑或定位件(尤其适配空间受限的便携设备)。
  • 小型屏蔽结构或支架(结合表面处理可用于局部屏蔽)。
  • 结构连接件、微型卡位/支撑柱、或作为机电装置中的精密弹性元件(视具体几何形状与热处理状态而定)。
  • 可用于物联网终端、穿戴设备、消费类电子、传感器模块等领域。

六、装配与维护建议

  • 装配方式:可考虑机械卡合、点焊/激光焊或结构胶粘接,根据材料热敏性与周边元件要求选择。
  • 焊接注意:若需焊接,建议采用激光或微点焊并在焊后进行钝化处理以恢复表面抗腐蚀性。
  • 防护与清洁:避免强酸强碱接触;长期户外或苛刻环境建议加防护涂层或选用更高等级不锈钢处理。
  • 检验:建议在首件和批量生产时做尺寸、表面质量与材料证书检验,必要时做疲劳与腐蚀试验验证。

七、采购与技术支持

  • 包装与最小订购量(MOQ):由供应方根据客户需求与产能确定,包装可按洁净度等级或抗压要求定制。
  • 技术资料:材料证书(MTR)、尺寸图、装配建议与表面处理报告可随订单提供。
  • 定制开发:可根据客户对形状、公差、表面和处理要求进行小批量样件开发与验证。
  • 联系方式:请在询价或下单时注明型号 BW0019AG-L3.5W1.5H3.5、所需表面处理、加工公差与预计年用量,以便提供准确交期与报价。

概述以上信息旨在帮助工程选型与工艺评估。具体技术参数与性能验证建议在量产前通过样件测试与工况模拟确认。

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