Model & package intelligence
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BAT WIRELESS BWMMCX-KEF-B
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BAT WIRELESS BWMMCX-KEF-B
- Type
- BAT WIRELESS
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- BAT WIRELESS
- Electronic Component
- BWMMCX-KEF-B
- Electronic Component
- 1
- Package
- SMD
- Electronic Component
- Electronic Component
- Electronic Component
- RFCoaxial Connector
- Electronic Component
- 0.527g
- Electronic Component
- 50Ω
- Frequency
- 6GHz
- Electronic Component
- 1
- Electronic Component
- BM0264566475
- RF
- MMCX
- Operating Temperature
- 65℃~+165℃
- Interface Type
- Electronic Component
- Electronic Component
- 1
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BWMMCX-KEF-B 产品概述
一、产品简介
BWMMCX-KEF-B 是蝙蝠无线（BAT WIRELESS）推出的一款板端单口 MMCX 系列射频同轴连接器，采用 SMD 封装与偏脚（偏心脚）结构，适用于空间受限的高可靠射频应用。接口为内孔式（母针内孔），阻抗严格控制为 50Ω，工作频率覆盖至 6GHz，额定电压 170V，工作温度范围宽（-65℃ 至 +165℃），适合苛刻环境下长期稳定工作。
二、主要参数
- 连接器类型：板端（PCB 贴装）
- 接口类型：内孔（母座式）
- 端口数量：1（单口）
- 射频系列：MMCX
- 阻抗：50Ω
- 频率范围：直流至 6GHz（典型设计上限）
- 样式：偏脚（偏轴焊盘，便于贴装与力学支撑）
- 封装形式：SMD（表面贴装）
- 额定电压：170V
- 工作温度：-65℃ ~ +165℃
- 品牌：BAT WIRELESS（蝙蝠无线）
（实际安装及应用中请参考样品实测数据与制造商出具的详细技术文档）
三、结构与材料特性
BWMMCX-KEF-B 采用紧凑型金属外壳与内置绝缘体设计，内孔式中心导体便于与标准 MMCX 插件配合，外壳与接地脚为 SMD 焊盘形式以保证良好焊点强度与接地可靠性。常用接触件镀层（如镀金或镍金）提升电气接触稳定性与抗腐蚀能力。偏脚结构提升焊接强度并降低装配应力对射频性能的影响。
四、装配与焊接建议
- 推荐采用标准回流焊工艺进行 PCB 装贴，焊膏量与焊盘设计应参照制造商推荐封装图。
- 贴片时注意定位，避免偏位造成接触不良或机械应力集中。
- 焊后进行外观与 X 射线检查以确认焊点完整性，必要时做拉拔/扭矩测试验证机械可靠性。
- 使用时匹配合格的 MMCX 插头以保证长期低损耗连接。
五、典型应用
适用于无线通信模块、射频前端、移动终端扩展天线接口、卫星导航（GNSS）模块、物联网终端、便携式测量设备、车载通信系统及其他要求高密度、宽温域和可靠性的射频连接场景。
六、可靠性与环境适应
设计满足宽温工作要求，适合极端高低温环境的长期工作。偏脚 SMD 结构增强机械抗振动与冲击性能。推荐在具体应用中进行热循环、盐雾和振动等可靠性试验以验证产品在目标环境下的性能稳定性。
七、订购与技术支持
型号：BWMMCX-KEF-B；单口 SMD 板端 MMCX 内孔连接器。订购时请提供所需数量、是否有特殊镀层或密封需求、以及 PCB 尺寸与装配工艺要求。蝙蝠无线技术支持团队可提供封装尺寸图、PCB 焊盘建议、以及配合测试报告以便快速集成与量产。
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