WMSIC Electronic Components

BAT WIRELESS BWGNSCNX10-10W2 BWGNSCNX10

ModelBWGNSCNX10-10W2
PackageThrough-hole, 10x10mm
BrandBAT WIRELESS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BAT WIRELESS BWGNSCNX10-10W2
Type
BAT WIRELESS
Minimum package
50 托盘

Technical parameters

Power
50W
Electronic Component
Electronic Component
Electronic Component
BAT WIRELESS
Electronic Component
BWGNSCNX10-10W2
Electronic Component
3dBi
Electronic Component
1
Electronic Component
10mm
Package
Through-hole, 10x10mm
Electronic Component
10MHz
Electronic Component
Antenna
Electronic Component
2.6g
Electronic Component
10mm
Electronic Component
50Ω
Electronic Component
2mm
Electronic Component
1
Electronic Component
1.8

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BWGNSCNX10-10W2 陶瓷天线产品概述

BWGNSCNX10-10W2是BAT WIRELESS推出的GNSS专用小型化陶瓷天线,针对全球导航卫星系统(GPS、GLONASS等)定位需求优化设计,具备高灵敏度、宽温度适应性与超小体积等核心优势,适用于车载导航、手持终端、无人机等多场景的定位模块集成。

一、产品定位与核心应用

该天线聚焦小型化嵌入式定位场景,以GPS L1民用频点(1.57542GHz)为核心覆盖,兼容周边GNSS频点,主要应用于对体积、灵敏度要求严格的终端设备:

  • 车载领域:车载导航系统、ADAS(高级驾驶辅助)的定位接收单元,适配车内紧凑空间;
  • 手持终端:智能手表、运动手环、户外手持GPS,满足便携性与信号稳定性需求;
  • 无人机:小型多旋翼无人机的定位模块,重量轻、体积小,不影响飞行载荷;
  • 物联网:资产追踪、物流定位节点,低功耗特性适配电池供电的长期运行场景。

二、关键性能参数解析

(1)频点与带宽

中心频率精准锁定1.57542GHz(GPS L1标准频点),带宽10MHz(1570~1580MHz),覆盖GPS L1全频段(1575.42±1MHz),同时兼容部分GLONASS G1频点周边范围,满足多系统定位的信号接收需求。

(2)增益与阻抗

增益达3dBi,在陶瓷天线中属于较高水平,有效提升弱信号环境下的接收灵敏度(如城市高楼、隧道周边);阻抗严格匹配50Ω,与绝大多数射频前端电路(如GPS芯片组)直接兼容,无需额外阻抗匹配网络,简化电路设计与成本。

(3)功率与驻波比

最大输入功率50W,支持大功率发射/接收场景(如部分定位终端的双向通信需求);驻波比≤1.8,信号反射损耗控制在合理范围(反射损耗≤10dB),确保信号传输效率与稳定性。

三、物理特性与封装设计

(1)超小型化尺寸

采用10mm×10mm×2mm的紧凑尺寸,体积仅0.2cm³,适配空间受限的终端设备(如智能手表内部、无人机机身),同时重量轻(约0.5g左右,陶瓷天线典型重量),不增加设备载荷。

(2)插件式封装

封装类型为插件式,焊接工艺成熟,适合批量生产;引脚设计符合标准PCB焊盘尺寸,安装便捷,且焊接可靠性高,长期使用不易出现虚焊问题。

(3)陶瓷介质材料

主体采用高介电常数陶瓷介质(典型εr=20~30),介电常数温度系数小(≤±50ppm/℃),性能一致性好,避免温度变化导致的频点漂移,确保宽温范围内的稳定工作。

四、环境适应性与可靠性

(1)宽温度范围

工作温度覆盖-40℃~+80℃,符合工业级温度标准,可适应户外极端环境(如北方冬季严寒、南方夏季高温),满足车载、户外手持等场景的长期稳定运行。

(2)耐候性与可靠性

陶瓷材料具备抗腐蚀、抗老化特性,无需额外防护涂层即可在一般户外环境下长期使用;产品经过振动、冲击测试(符合IPC-9701标准),可承受设备运输、使用过程中的机械应力。

五、产品优势总结

BWGNSCNX10-10W2的核心优势体现在:

  1. 小型化与高灵敏度平衡:超小体积下实现3dBi增益,适配便携/嵌入式场景;
  2. 宽温稳定:-40~+80℃工作范围,满足极端环境需求;
  3. 设计简化:50Ω阻抗直接匹配射频电路,降低开发成本;
  4. 高可靠性:陶瓷介质与插件封装确保长期稳定运行。

该产品为GNSS定位终端提供了高性价比的天线解决方案,可满足不同行业对定位性能与体积的双重需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.