Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
CJ TK3904LED03
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- CJ TK3904LED03
- Type
- WBFBP-03E
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- CJ
- Electronic Component
- TK3904LED03
- Electronic Component
- 1
- Package
- WBFBP-03E
- Electronic Component
- 1 NPN
- Electronic Component
- Transistor(BJT)
- Electronic Component
- 0.01g
- Electronic Component
- 1
- Electronic Component
- BM0264249975
- Operating Temperature
- 55℃~+150℃
- Transistor Type
- NPN
- Frequency(f T)
- 300MHz
- Power Dissipation(Pd)
- 100mW
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TK3904LED03（三极管）产品概述
一、产品简介
TK3904LED03 是 CJ（江苏长电/长晶）推出的一款小功率 NPN 三极管，封装为 WBFBP-03E。该器件适用于低功耗开关和小信号放大场合，典型应用包括 LED 驱动、信号级放大、开关接口及高频小信号处理等。
二、主要参数（关键指标）
- 晶体管类型：NPN
- 集电极电流 Ic：200 mA（最大）
- 集-射极击穿电压 Vceo：40 V
- 耗散功率 Pd：100 mW
- 直流电流增益 hFE：100（典型）
- 特征频率 fT：300 MHz
- 集电极截止电流 Icbo：100 nA
- 集电极饱和电压 VCE(sat)：300 mV（典型）
- 工作温度范围：-55 ℃ ~ +150 ℃
- 射-基极击穿电压 Vebo：6 V
- 封装：WBFBP-03E
- 单位数量：1 个
三、性能亮点与适用场景
本型号具有较高的低频增益（hFE≈100）与较高的特征频率（fT=300MHz），因此在小信号放大与中高频开关中表现良好。100 mW 的耗散功率限制了其在高电压或高功耗场合的使用，但在 LED 驱动（低压大电流脉冲）、逻辑级开关和前级放大器非常合适。
四、使用注意事项
- 功率限制：Pd=100 mW，若在 Ic=200 mA 下工作，允许的 Vce 极小（Vce_max ≈ Pd/Ic = 0.5 V），因此大电流工作时应使器件处于饱和或下降电压很小的状态。
- 饱和驱动：推荐以低阻抗驱动基极，考虑饱和时 hFE 降低（一般取 1020），若以 5V MCU 输出（经限流电阻）驱动 100 mA，则基极电流应设计在 510 mA 级别。
- 热设计：虽为小封装，但在连续大电流脉冲下需做好散热，PCB 上增加铜箔和过孔有助于散热。
- 极限电压：Vceo=40 V 与 Vebo=6 V，应避免反向或超压应力。
- ESD 与储存：注意静电防护，按常规湿热与回流工艺规范操作。
五、封装与焊接建议
WBFBP-03E 属小型贴片封装，适合自动贴装与回流焊。建议遵循制造商的回流温度曲线，焊接后避免长期在高温环境下工作以延长寿命。PCB 布局上，集电极热流路径应尽量短，并保留热铜层以提高散热能力。
六、典型应用与选型建议
推荐用于：指示灯/小功率 LED 驱动（低电压）、逻辑电平开关、输入级放大器、射频前端小信号放大等。若系统需要频繁在高电流高 Vce 下工作，应选择更高 Pd 的器件；如需更高 Vceo 或更大 Ic，可参考功率级 NPN 器件。
如需更详细的 I-V 曲线、典型电路或替代型号建议，可提供应用场景和电路参数，我将基于要求给出更具体的设计建议。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
