WMSIC Electronic Components

CJ RB160M-40 RB160M

ModelRB160M-40
PackageSOD-123
BrandCJ
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
CJ RB160M-40
Type
SOD-123
Minimum package
3000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CJ
Electronic Component
RB160M-40
Electronic Component
1
Package
SOD-123
Electronic Component
Schottky Diode
Electronic Component
0.034g
Electronic Component
1
Electronic Component
BM0230014861
Current
1A
Diode
Electronic Component
Current(Ir)
30uA@40V
(Vf)
510mV@1A
Electronic Component
Electronic Component
Electronic Component
3000
Voltage Rating(Vr)
40V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RB160M-40 产品概述

一、产品简介

RB160M-40 是 CJ(江苏长电/长晶)出品的一款独立式肖特基二极管,采用 SOD-123 小封装,面向低压高频开关和整流场景。器件在 1A 工作电流时表现出优异的低正向压降(Vf = 0.51V@1A),直流反向耐压为 40V,适用于空间受限且需降低导通损耗的应用。

二、主要特性

  • 肖特基结构,低正向压降:Vf = 510mV @ 1A,可显著降低导通损耗。
  • 额定整流电流:1A,满足多数小功率电源和保护电路需求。
  • 反向电压:Vr = 40V,适合 12V/24V 级别的系统。
  • 低反向漏电流:Ir = 30µA @ 40V(室温标称),在高温下会有所上升需注意。
  • 非重复峰值浪涌电流 Ifsm = 15A,具备一定的抗冲击能力用于瞬态吸收。
  • SOD-123 封装,适合自动贴装和高密度 PCB 布局。

三、电气与热特性说明

在 1A 连续工作时,二极管的功耗约为 P = Vf × I ≈ 0.51W;由于 SOD-123 封装散热有限,建议在 PCB 设计中配合适量铜箔散热(焊盘和散热铜皮)并进行电流降额以保证可靠性。反向漏电随温度上升显著增加,温度敏感场合需在选型和热设计时预留裕量。Ifsm 为非重复瞬态能力,能在突发浪涌时提供保护,但不作为长期过载手段。

四、典型应用场景

  • 开关电源输出整流与续流二极管
  • 逆向电流保护(电源反接保护、二极管 OR-ing)
  • DC-DC 转换器、充电电路、汽车电子(低压部分)
  • 小功率适配器、通信设备和消费类电子的快速恢复/整流应用

五、选型与使用建议

  • 连续电流接近 1A 时,应在 PCB 上扩大铜箔面积并采用多层散热设计;必要时按实际环境和温升进行电流降额。
  • 留意反向漏电随温度变化,工作在高温、高阻态应用时需验证实际漏电是否满足系统要求。
  • 焊接建议遵循 JEDEC/J-STD-020 回流曲线,SOD-123 适合回流焊贴装;手工焊接时避免过热焊点。
  • 对于含瞬态冲击的系统,确认 Ifsm 能覆盖预期浪涌并考虑串联熔断或限流保护以提升可靠性。
  • 储运和装配环节注意静电防护(ESD),并按厂商推荐的封装方向和焊盘设计布局。

六、可靠性与封装

CJ(江苏长电/长晶)出品,SOD-123 封装尺寸紧凑,适配自动贴装与卷盘供料。器件适用于量产电子制造,建议在量产前进行样片验证(包括热测试、寿命试验和浪涌测试),以确保在目标应用中的长期可靠性。

总之,RB160M-40 以其低正向压降和紧凑封装,适合要求降低导通损耗、空间受限的低压整流与保护场景。设计时重点关注 PCB 散热与温度下的漏电管理,可获得稳定且高效的系统表现。

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