WMSIC Electronic Components

cjiang FTC252010S4R7MBCA

ModelFTC252010S4R7MBCA
PackageSMD,2x2.5mm
Brandcjiang
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
cjiang FTC252010S4R7MBCA
Type
CJIANG
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CJIANG
Electronic Component
FTC252010S4R7MBCA
Electronic Component
1
Package
SMD,2x2.5mm
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
0.058g
Inductor
4.7uH
Electronic Component
1
Electronic Component
BM0230864103
Current
2A
Resistor(DCR)
160mΩ
Electronic Component
Electronic Component
Electronic Component
3000
and Current(Isat)
2.6A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FTC252010S4R7MBCA 产品概述

一、产品简介

FTC252010S4R7MBCA 是长江微电(cjiang)推出的一款功率型贴片电感,额定电流 2A,感值 4.7µH,公差 ±20%。器件以小型 SMD 封装(2.0 × 2.5 mm)为特点,适合对体积和高度有严格限制的电源模块与消费电子产品中的电磁能量储存与滤波任务。

二、主要参数

  • 感值:4.7 µH ±20%
  • 额定电流:2 A
  • 饱和电流(Isat):2.6 A
  • 直流电阻(DCR):160 mΩ
  • 封装:SMD,尺寸约 2.0 × 2.5 mm
  • 品牌:cjiang(长江微电)
    这些参数决定了器件在开关电源或滤波网络中的通用性与功率损耗水平。

三、关键特性与优势

  • 小型化封装,便于高密度 PCB 设计与移动设备应用。
  • 较高的饱和电流(2.6 A),在短时冲击或高峰负载条件下仍能维持磁性性能。
  • 直流电阻 160 mΩ 在同类小型功率电感中属于可接受范围,但在高电流场景下会产生明显的 I²R 损耗,需要考虑热管理。举例:在 2 A 连续电流下,理论损耗约 0.64 W,应预估温升与效率影响。
  • ±20% 感值公差适用于一般电源滤波与能量存储场景,但对高精度谐振或严格环路控制的电路需评估容差影响。

四、典型应用场景

  • 降压(buck)/ 升压(boost)DC–DC 转换器的电感元件。
  • 输入/输出滤波器,用于抑制开关噪声与射频干扰。
  • 便携式设备、物联网终端、LED 驱动与消费类电源模块等对体积和成本敏感的场景。

五、布局与使用建议

  • 将电感尽量贴近开关节点或输入/输出端,缩短高频回路的环路面积以减少 EMI。
  • 由于 DCR 引起的功耗不可忽视,建议在设计时对连续工作电流做适当降额(例如留 20–30% 余量),以提升可靠性与热稳定性。
  • 对于长期高电流或高温工作环境,应评估 PCB 散热、铜箔面积及必要的散热措施。
  • 符合常规无铅回流焊工艺,焊接时遵循元件供应商的回流温度曲线与湿热处理建议以防潮湿吸收问题。

六、储存与可靠性注意事项

  • 建议按电子元器件通用规范干燥保存,避免长期潮湿环境导致回流焊时封装问题。
  • 在高振动或冲击环境下应评估封装强度与焊点可靠性,必要时增加机械固定或改用更大封装型号。

七、选型与替代建议

  • 在需要更低损耗或更高持续电流能力的设计中,可考虑采用更低 DCR 或更大体积的电感规格。
  • 若对感值精度或温漂有更高要求,可优先选择感值容差与温性能更好的系列产品或使用外部补偿电路。

总结:FTC252010S4R7MBCA 提供了体积小、饱和电流相对较高的解决方案,适合空间受限且负载峰值较高的电源应用。设计时需综合考虑 DCR 带来的功耗与热管理,合理降额与布局可以确保稳定可靠的工作表现。

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