WMSIC Electronic Components

cjiang FHD4020S-330MT FHD4020S

ModelFHD4020S-330MT
PackageSMD,4x4mm
Brandcjiang
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
cjiang FHD4020S-330MT
Type
CJIANG
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CJIANG
Electronic Component
FHD4020S-330MT
Electronic Component
1
Package
SMD,4x4mm
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
0.245g
Inductor
33uH
Electronic Component
1
Electronic Component
BM0233287971
Current
860mA
Resistor(DCR)
650mΩ
Electronic Component
Electronic Component
Electronic Component
3000
and Current(Isat)
1.4A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FHD4020S-330MT 产品概述

FHD4020S-330MT 是长江微电(cjiang)推出的一款表面贴装功率电感,封装尺寸为 4 × 4 mm。该器件标称电感值 33 µH(±20%),额定直流电流 860 mA,饱和电流(Isat)1.4 A,直流电阻(DCR)约 650 mΩ。凭借紧凑的 SMD 外形和中等电流能力,适合用于各种功率滤波与能量储存场合,尤其适配空间受限且对电流等级有中等要求的移动设备与工业控制电源模块。

一、主要参数与含义说明

  • 电感值:33 µH ±20% —— 适用于低频滤波、降压型开关电源输出滤波及噪声抑制。±20% 为典型工差,若对精度要求高应选择更窄公差产品或后端校准。
  • 额定电流:860 mA —— 在厂家规定的温升条件下可持续通过的电流值,长期使用建议不超过此值以避免温升或寿命下降。
  • 饱和电流(Isat):1.4 A —— 当通过电流接近或超过该值时,电感会明显降值(磁芯进入饱和区),磁性能衰减需在设计中避免触及此区段。
  • 直流电阻(DCR):650 mΩ —— 较高的 DCR 会带来显著的铜损(I^2R 损耗),对效率和发热有影响,需在热预算和效率目标中予以考虑。
  • 封装:SMD,4 × 4 mm —— 适合回流焊工艺、便于自动化贴装,利于高密度 PCB 布局。

二、典型应用场景

  • 降压型(Buck)开关电源的输出滤波电感(中低电流应用)。
  • 电源噪声滤波与 EMI 抑制,特别是对低频噪声的衰减。
  • 电池供电设备中的能量储存与瞬态响应改善,如便携式媒体设备、蓝牙/无线模块电源等。
  • 工业控制和传感器模块的局部电源管理(中低功率)。

三、设计与选型注意事项

  • 电流裕量:长期工作电流建议小于额定电流 860 mA,峰值冲击电流应避免接近或超过 1.4 A 的饱和点,以防电感值突降导致电源环路不稳定或输出波形恶化。
  • 损耗与效率:650 mΩ 的 DCR 在中等电流下会造成较明显的铜损,若目标为高效率或高电流,应考虑 DCR 更低或尺寸更大的电感产品。
  • 频率响应:33 µH 值较大,适合较低开关频率的电源;在高频开关设计中,可能需要更小电感或不同磁芯材料以获得理想的纹波和稳定性。
  • 温升与散热:高 DCR 和靠近额定电流工作会引起温升,需在 PCB 设计时考虑散热路径和热沉效果。

四、PCB 布局与焊接建议

  • 焊盘与走线:为减小走线电阻与散热阻抗,电感两端到电源回路的走线应尽量短且宽;焊盘尺寸遵循厂家推荐的回流焊工艺规范。
  • 接地与去耦:与电感配合的旁路电容应尽量靠近负载或开关器件放置,减少回流环路面积,降低 EMI。
  • 回流焊温度曲线:遵循制造商的焊接温度规范与 IPC 标准,避免过热导致磁芯性能退化或封装损伤。未提供明确曲线时,按常规无铅回流曲线进行控制并做批量验证。

五、测试与验证建议

  • LCR 测量:在目标工作频率和偏置电流条件下测量实际电感值,验证在直流偏置下的电感衰减特性。
  • DCR 测试:使用低阻测量仪(四线法)准确评估直流电阻,结合电流-温升测试评估实际运行中的功耗。
  • 饱和测试:通过逐步增加直流偏置电流,观察电感值的下降点(饱和行为),确认 Isat 是否满足所需峰值条件。
  • 热循环与可靠性:进行温升、热循环与震动试验以评估长期可靠性,尤其在汽车或工业环境中应用时必须验证。

六、替代与扩展建议

  • 若需更高通过电流或更低 DCR,可选用截面更大、铜线更粗或不同磁芯材料的型号。
  • 若对电感精度要求较高或需较小体积,可考虑多种封装尺寸和公差(±10%、±5%)的产品系列。
  • 在高频开关拓扑中,考虑选择电感值更低、频率特性更好的功率电感以优化纹波与效率。

总结:FHD4020S-330MT 以 4×4 mm 的紧凑封装和 33 µH 的电感值定位于中低频、空间受限且电流在数百毫安至一安培区间的应用场景。选用时需兼顾其较高 DCR 对效率与发热的影响,以及饱和电流限制对瞬态和峰值电流的约束。若需进一步的封装图、回流焊温度谱或大批量可靠性数据,建议联系长江微电获取完整的器件数据手册与应用指南。

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