WMSIC Electronic Components

cjiang FHD4020S-3R3MT FHD4020S

ModelFHD4020S-3R3MT
PackageSMD,4x4mm
Brandcjiang
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
cjiang FHD4020S-3R3MT
Type
CJIANG
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CJIANG
Electronic Component
FHD4020S-3R3MT
Electronic Component
1
Package
SMD,4x4mm
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
0.25g
Inductor
3.3uH
Electronic Component
1
Electronic Component
BM0231116095
Current
4A
Resistor(DCR)
73mΩ
Electronic Component
Electronic Component
Electronic Component
3000
and Current(Isat)
5.9A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FHD4020S-3R3MT 产品概述

一、产品简介

FHD4020S-3R3MT 是长江微电(cjiang)推出的一款 SMD 功率电感,封装尺寸约 4.0 × 4.0 mm。该器件额定电感 3.3 µH,公差 ±20%,面向中小功率开关电源与电流滤波场合设计,兼顾体积、承流能力与损耗控制,适合集成化电源模块和板级电源滤波使用。

二、主要参数

  • 电感值:3.3 µH ±20%
  • 额定直流电流(Irated):4.0 A
  • 饱和电流(Isat):5.9 A
  • 直流电阻(DCR):73 mΩ(典型值)
  • 封装形式:SMD,尺寸约 4 × 4 mm
  • 品牌:cjiang(长江微电)

三、核心特性

  • 高承流能力:额定承流 4A,饱和点 5.9A,适合中高电流密度的降压转换器与功率滤波。
  • 紧凑封装:4×4 mm SMD 形态便于自动化贴装,利于多相或高密度布局。
  • 可控损耗:73 mΩ 的 DCR 在体积极小的前提下提供较低的直流损耗,但在 4A 工作时仍需关注功耗与发热。

四、电气与热设计注意事项

  • 损耗估算:直流损耗 P_DC ≈ I_RMS^2 × DCR。若连续等效电流为 4 A,则 P ≈ 4^2 × 0.073 ≈ 1.17 W(实际应用中按 RMS 或占空比修正)。
  • 饱和裕量:Isat=5.9A 表示大电流下励磁接近饱和,建议在稳态和峰值电流下至少保留 20%~30% 的裕量以避免电感值急剧下降。
  • 热管理:在高电流或高占空比条件下需评估温升,优化 PCB 散热(加宽导线、铜箔散热区、过孔热传导等),并避免紧邻高温元件。

五、典型应用场景

  • 降压(Buck)转换器电感,尤其是 PCB 空间受限的中小功率点;
  • 模块化 DC-DC 电源与多相电源滤波单元;
  • LED 驱动、车载电子子系统(需符合热与电流规范时)及电源输入滤波。

六、选型与评估建议

  • 根据实际电流波形使用有效值(RMS)计算损耗;对于开关电源,关注电流纹波对等效损耗和磁饱和的影响。
  • 若系统存在瞬态峰值电流接近或超过 Isat,应选用更大饱和电流规格或并联方案。
  • 若对纹波抑制或稳定性有更高要求,可结合电容、电路拓扑进行综合设计验证。

七、封装与可靠性

  • SMD 4×4 mm 封装利于自动贴装与回流焊工艺,通过合理的 PCB 支撑和焊盘设计可提升可靠性。
  • 推荐在设计阶段确认产品的温度系数、机械振动与焊接可靠性(如需可向供应商索取具体环境与寿命测试报告)。

八、存储与焊接工艺提示

  • 遵循一般 SMD 器件的防潮与回流焊规范;如长时间暴露在潮湿环境,建议回潮处理后再回流焊。
  • 焊盘设计时注意避开锐角、提供合适焊盘尺寸与热扩散路径,以降低焊接应力与热阻。

九、结语

FHD4020S-3R3MT 以其 3.3 µH/4A 的额定能力与 5.9A 的饱和上限,适合对体积与承流同时有要求的应用场景。设计时重点考虑 DCR 带来的功耗、磁饱和裕量与 PCB 散热安排,必要时通过实物测试(直流偏置下电感测量、热成像)来验证在目标工况下的性能。若需更详细的典型曲线或可靠性数据,可向长江微电索取器件数据手册与测试报告。

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