WMSIC Electronic Components

cjiang FXL0530-6R8-M FXL0530

ModelFXL0530-6R8-M
PackageSMD,5.2x5.4mm
Brandcjiang
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
cjiang FXL0530-6R8-M
Type
CJIANG
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CJIANG
Electronic Component
FXL0530-6R8-M
Electronic Component
1
Package
SMD,5.2x5.4mm
Type
Inductor
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
0.598g
Inductor
6.8uH
Electronic Component
1
Electronic Component
BM0230945339
Current
3.5A
Resistor(DCR)
90mΩ
Electronic Component
Electronic Component
Electronic Component
2000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FXL0530-6R8-M 产品概述

一、主要参数

FXL0530-6R8-M 为长江微电(cjiang)推出的一款功率一体成型贴片电感,关键参数如下:

  • 电感值:6.8 μH ±20%
  • 额定电流(Irated):3.5 A(连续工作)
  • 饱和电流(Isat):4.0 A(磁饱和时电感降到规定值的标准)
  • 直流电阻(DCR):约 90 mΩ
  • 类型:一体成型功率电感(molded power inductor)
  • 封装:SMD,尺寸 5.2 × 5.4 mm

二、产品特点

  • 高电流承载:额定电流 3.5A,适用于中小功率开关电源与电源滤波场合;4A 的饱和电流保证了较好的直流偏置特性。
  • 低 DCR:90 mΩ 左右的直流电阻,有利于降低功耗与热量积累,提升转换效率。
  • 一体成型结构:封装机械强度高,适合自动化贴装与回流焊工艺,并能提供较好的机械与环境可靠性。
  • 紧凑尺寸:5.2×5.4mm 的 SMD 封装便于在有限 PCB 面积上布局,适配空间受限的电源模块。

三、典型应用

  • 开关稳压器(Buck、Boost)输入/输出滤波或储能元件。
  • 电源管理模块、DC-DC 转换器、电源滤波网络。
  • 工业控制、通信设备、消费电子的电源子系统。
    (用于汽车或严苛环境时,请以厂方具体车规级或环境规格为准)

四、选型与设计注意事项

  • 电流与电感偏差:额定电流 3.5A 为连续工作能力,建议在长期设计中留有裕量(常见做法为取额定电流的 70–90%),以降低温升和延长寿命。饱和电流 4A 为电感进入饱和状态的参考,应保证工作点低于该值以维持稳定电感量。
  • 温升与散热:尽量将器件靠近铜箔丰厚的电源回路并采用多过孔导热至内/底层,减小 DCR 引起的发热。
  • PCB 布局:电感与开关器件、二极管/电容尽量靠近摆放,走线短且宽;输入输出地回路保持低阻抗闭合路径;必要时增加散热铜箔与过孔。
  • 测量条件:电感值受频率与直流偏置影响显著,推荐在无直流偏置和/或厂方给定测试频率下测量并参考数据表。

五、测试与可靠性验证

  • 常用验证项目:DCR 测量、一致性电感值测试(不同频率)、直流电流扫描以确定 Isat、温升测试(在额定电流下的温升)、机械振动与回流焊可焊性测试。
  • 环境与寿命:一体成型结构对振动和冲击耐受性较好,但长期高温或高湿环境可能影响性能,建议参考供应商的温度与湿度存储/工作规范。

六、封装与采购建议

  • 封装为 SMD(5.2×5.4mm),适合贴片、回流焊工艺。常见供货形式为卷盘(Tape & Reel),具体包装和最低订购量请向供应商确认。
  • 采购时确认完整数据表(包括测试频率、温升曲线、电流-电感特性曲线和回流焊温度曲线),并索取样品测试以验证在目标电路中的表现。

备注:本文中参数基于给定基础信息整理,设计与应用时请以长江微电正式数据表与样品测量结果为准。

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