WMSIC Electronic Components

cjiang FTC303020D6R8MBCA

ModelFTC303020D6R8MBCA
PackageSMD,3x3mm
Brandcjiang
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
cjiang FTC303020D6R8MBCA
Type
SMD, 3X3MM
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CJIANG
Electronic Component
FTC303020D6R8MBCA
Electronic Component
1
Package
SMD,3x3mm
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
0.22g
Inductor
6.8uH
Electronic Component
1
Electronic Component
BM0257252778
Current
3.2A
Resistor(DCR)
107mΩ
Electronic Component
Electronic Component
Electronic Component
3000
and Current(Isat)
4.5A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FTC303020D6R8MBCA 产品概述

FTC303020D6R8MBCA 为长江微电(cjiang)系列小型功率电感,采用 SMD 贴片封装(尺寸 3×3 mm),专为空间受限的开关电源与电源滤波场合设计。该器件兼顾体积与电流承载能力,适用于各类降压转换器、功率模块及电源滤波应用。

一、主要参数

  • 品牌:cjiang(长江微电)
  • 型号:FTC303020D6R8MBCA
  • 电感值:6.8 μH
  • 公差:±20%
  • 额定电流(Irated):3.2 A(连续工作建议值)
  • 饱和电流(Isat):4.5 A(超过该值电感量显著下降)
  • 直流电阻(DCR):107 mΩ
  • 封装:SMD,3×3 mm

二、产品特性

  • 小型化封装:3×3 mm SMD 形式,便于高密度 PCB 布局。
  • 良好电流承载能力:额定电流 3.2A,饱和电流 4.5A,适合中小功率 DC-DC 转换器。
  • 稳定性:常温下电感值满足 ±20% 公差,符合功率电感常用规范。
  • 注意损耗:相对较高的 DCR(107 mΩ)意味着在大电流下存在显著铜损,应在设计时评估发热与效率影响。

三、典型应用场景

  • 同步/非同步降压(Buck)转换器的储能电感
  • 电源模块输出滤波与去耦
  • LED 驱动电源、便携设备电源管理
  • 工控与消费电子中对体积有严格限制但需中等电流承载的电源部分

四、设计与选型建议

  • 电流余量:长期工作电流建议不超过额定电流 3.2A,以限制温升并延长可靠性;瞬时峰值应低于饱和电流 4.5A,避免电感量急剧下降影响环路性能。
  • 损耗估算:在额定电流下的铜损可按 P = I^2·DCR 估算。例如 I = 3.2A 时,P ≈ 3.2^2×0.107 ≈ 1.10 W,此类热量需良好散热路径(铜箔、过孔等)以控制温升。
  • 对效率的影响:DCR 较大时会降低整体转换效率,设计时可考虑在允许的前提下选择低 DCR 或更大封装的电感以降低损耗。
  • 频率特性:具体核心损耗与频率相关,选型时应参考厂方频率特性曲线并在目标工作频率下做实验验证。

五、封装与焊接建议

  • PCB 布局:尽量缩短电感与 MOSFET/电容之间的回流路径,增大焊盘铜面积以利于散热;必要时在焊盘下设置多盏热沉过孔导至内层/底层。
  • 回流焊:适用标准无铅回流焊工艺;建议遵守制造商的温度曲线与焊接说明,避免长期高温对磁芯特性产生影响。
  • 机械固定:在可预见的振动环境下,应检查焊盘设计及周边固定结构以避免受力导致焊点疲劳。

六、常见注意事项

  • 公差 ±20% 对精密滤波电路需预留设计裕量;若系统对电感精度要求高,应选择精密电感或进行漂移补偿。
  • 如需长期稳定的低温升方案,可考虑并联多只电感或选择更大封装/更低 DCR 的替代品。
  • 在实际电路中建议做热成像或温升测试,验证在指定环境下的可靠性与效率表现。

总结:FTC303020D6R8MBCA 在体积受限但需中等电流承载的电源应用中表现均衡,设计时需关注其较高的 DCR 带来的功耗与温升问题,通过合理的电流预留与 PCB 散热设计可取得较好稳定性与可靠性。若有更具体的应用场景(工作频率、占空比、允许温升等),可提供以便给出更精确的选型与布局建议。

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