WMSIC Electronic Components

CCTC TCC0805COG101J500BT

ModelTCC0805COG101J500BT
Package0805
BrandCCTC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
CCTC TCC0805COG101J500BT
Type
CCTC
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CCTC
Electronic Component
TCC0805COG101J500BT
Electronic Component
1
Electronic Component
100pF
Package
0805
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±5%
Electronic Component
0.068g
Electronic Component
1
Electronic Component
BM0263668651
Electronic Component
C0G
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TCC0805COG101J500BT 产品概述

1. 产品简介

TCC0805COG101J500BT 是一款由 CCTC(三环)公司生产的贴片多层陶瓷电容(MLCC),具有高精度、高稳定性和优异的温度特性。该电容广泛应用于各种电子设备中,特别是在需要高可靠性和稳定性的电路中,如通信设备、医疗设备、工业控制设备以及消费电子产品等。

2. 主要参数

  • 商品分类: 贴片电容(MLCC)
  • 容值: 100pF
  • 材质(温度系数): C0G(NP0)
  • 精度: ±5%
  • 额定电压: 50V
  • 封装: 0805(2.0mm x 1.25mm)

3. 产品特点

  • 高精度: 容值精度为±5%,确保电路设计的精确性和一致性。
  • 高稳定性: 采用C0G(NP0)材质,具有极低的温度系数,在宽温度范围内保持稳定的电容值。
  • 高可靠性: 通过严格的质量控制和测试,确保产品在各种应用环境下的高可靠性。
  • 小型化设计: 0805封装尺寸小巧,适合高密度PCB布局,节省空间。

4. 应用领域

TCC0805COG101J500BT 适用于多种电子设备和电路,包括但不限于:

  • 通信设备: 如手机、基站、路由器等,用于滤波、耦合和旁路电路。
  • 医疗设备: 如心电图机、血压计等,用于信号处理和电源管理。
  • 工业控制设备: 如PLC、变频器等,用于噪声抑制和信号调理。
  • 消费电子产品: 如电视、音响、游戏机等,用于电源滤波和信号耦合。

5. 技术规格

  • 电容值: 100pF
  • 温度系数: C0G(NP0),±30ppm/°C
  • 额定电压: 50V
  • 工作温度范围: -55°C 至 +125°C
  • 介质材料: 陶瓷
  • 封装尺寸: 0805(2.0mm x 1.25mm)
  • 引脚间距: 1.25mm
  • 重量: 约0.01g

6. 产品优势

  • 优异的温度特性: C0G(NP0)材质确保电容在宽温度范围内保持稳定的性能,适用于各种环境条件。
  • 高精度和高稳定性: 确保电路设计的精确性和一致性,提高整体系统的可靠性。
  • 小型化设计: 0805封装尺寸小巧,适合高密度PCB布局,节省空间,提高设计灵活性。
  • 广泛的应用领域: 适用于多种电子设备和电路,满足不同应用需求。

7. 使用注意事项

  • 焊接条件: 建议使用回流焊或波峰焊,焊接温度和时间应符合相关标准,避免过热导致电容损坏。
  • 存储条件: 应存放在干燥、无尘的环境中,避免高温、高湿和强磁场的影响。
  • 使用环境: 避免在超出额定电压和温度范围的条件下使用,以免影响电容性能和寿命。

8. 质量保证

CCTC(三环)公司严格按照ISO9001质量管理体系进行生产和管理,确保每一颗TCC0805COG101J500BT电容都符合高标准的质量要求。产品经过多项严格测试,包括电气性能测试、环境适应性测试和可靠性测试,确保在各种应用环境下的高可靠性和长寿命。

9. 包装与运输

  • 包装方式: 通常采用卷带包装,每卷3000pcs,方便自动化贴片设备使用。
  • 运输方式: 采用防静电包装,确保运输过程中不受静电损害。

10. 总结

TCC0805COG101J500BT 是一款高性能的贴片多层陶瓷电容,具有高精度、高稳定性和优异的温度特性,适用于多种电子设备和电路。其小型化设计和高可靠性使其成为现代电子设计中不可或缺的元件。CCTC(三环)公司通过严格的质量控制和测试,确保每一颗电容都符合高标准的质量要求,满足客户的各种应用需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.