WMSIC Electronic Components

CCTC TCC0805X7R564K500DT

ModelTCC0805X7R564K500DT
Package0805
BrandCCTC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
CCTC TCC0805X7R564K500DT
Type
0805
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CCTC
Electronic Component
TCC0805X7R564K500DT
Electronic Component
1
Electronic Component
560nF
Package
0805
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.068g
Electronic Component
1
Electronic Component
BM0264458161
Electronic Component
X7R
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TCC0805X7R564K500DT 产品概述

1. 产品简介

TCC0805X7R564K500DT 是一款由 CCTC(三环)公司生产的贴片多层陶瓷电容器(MLCC),广泛应用于各种电子设备中,用于滤波、耦合、旁路等电路功能。该电容器具有高可靠性、优异的电气性能和稳定的温度特性,适用于多种工业和消费电子应用。

2. 主要参数

  • 商品分类: 贴片电容(MLCC)
  • 容值: 560nF
  • 材质(温度系数): X7R
  • 精度: ±10%
  • 额定电压: 50V
  • 封装: 0805

3. 详细描述

3.1 容值与精度

TCC0805X7R564K500DT 的标称容值为 560nF,精度为 ±10%。这意味着在实际应用中,电容值可以在 504nF 到 616nF 之间波动。这种精度范围适用于大多数通用电路设计,尤其是在对电容值要求不特别严格的场合。

3.2 材质与温度系数

该电容器采用 X7R 材质,具有稳定的温度特性。X7R 表示在 -55°C 到 +125°C 的温度范围内,电容值的变化不超过 ±15%。这种特性使得 TCC0805X7R564K500DT 能够在宽温度范围内保持稳定的电气性能,适用于各种环境条件。

3.3 额定电压

TCC0805X7R564K500DT 的额定电压为 50V,这意味着它可以在不超过 50V 的电压下长期稳定工作。对于大多数低电压应用,如电源滤波、信号耦合等,50V 的额定电压提供了足够的安全裕量。

3.4 封装尺寸

该电容器采用 0805 封装,尺寸为 2.0mm x 1.25mm。这种小型封装使得 TCC0805X7R564K500DT 能够适应高密度 PCB 布局,满足现代电子设备对小型化和轻量化的需求。

4. 应用领域

TCC0805X7R564K500DT 广泛应用于以下领域:

  • 电源管理: 用于电源滤波、去耦和稳压电路,提高电源的稳定性和可靠性。
  • 信号处理: 用于信号耦合和旁路,减少信号噪声和干扰。
  • 消费电子: 用于手机、平板电脑、笔记本电脑等消费电子产品中的各种电路。
  • 工业控制: 用于工业自动化设备中的控制电路,确保设备的稳定运行。

5. 品牌与质量保证

TCC0805X7R564K500DT 由 CCTC(三环)公司生产,该公司是国内领先的电子元器件制造商,以其高质量和可靠性著称。CCTC 的产品经过严格的质量控制和测试,确保每一颗电容器都符合国际标准,满足客户的需求。

6. 总结

TCC0805X7R564K500DT 是一款高性能的贴片多层陶瓷电容器,具有 560nF 的容值、±10% 的精度、50V 的额定电压和稳定的 X7R 温度特性。其 0805 封装尺寸适合高密度 PCB 布局,广泛应用于电源管理、信号处理、消费电子和工业控制等领域。CCTC 公司的高质量保证使得 TCC0805X7R564K500DT 成为工程师和设计师的理想选择。

通过以上详细的产品概述,用户可以全面了解 TCC0805X7R564K500DT 的性能特点和应用场景,从而更好地选择和使用该产品。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.