WMSIC Electronic Components

CCTC TCC1206COG3R0C102DT

ModelTCC1206COG3R0C102DT
Package1206
BrandCCTC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

17 specifications

Core information

Product name
CCTC TCC1206COG3R0C102DT
Type
1206
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CCTC
Electronic Component
TCC1206COG3R0C102DT
Electronic Component
1
Electronic Component
3pF
Package
1206
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
0.045g
Electronic Component
1
Electronic Component
BM0264527808
Electronic Component
C0G
Voltage
1kV
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TCC1206COG3R0C102DT 产品概述

一、产品简介

TCC1206COG3R0C102DT 为 CCTC(三环)系列高稳定性贴片陶瓷电容(MLCC),额定电压 1 kV,标称容值 3 pF,温度特性 C0G(又称 NP0)。封装为 1206(约 3.2 × 1.6 mm),适合要求高稳定性、低损耗与高耐压的中高压与射频应用。

二、主要参数

  • 容值:3 pF
  • 额定电压:1 kV DC
  • 温度系数:C0G(0 ±30 ppm/°C)
  • 封装:1206(贴片)
  • 类型:多层陶瓷电容(MLCC)
  • 品牌:CCTC(三环)

三、性能特点

  • 温度稳定性优:C0G 温度系数极小,容值随温度变化极微弱,适合精密滤波与频率敏感电路。
  • 低介质损耗:较低的损耗角正切(DF),提高 Q 值,适合射频与高频应用。
  • 高耐压设计:1 kV 额定电压满足高压耦合、分压与脉冲电路需求。
  • 小体积大功效:1206 封装兼顾机械强度与装配密度,便于自动化贴装。

四、典型应用

  • 高压分压器、采样电容与探头补偿网络
  • 射频匹配、电路定谐与耦合网络
  • 精密时钟与滤波电路(要求极低温漂)
  • 医疗、航空、测试测量等对长期稳定性与可靠性要求高的场合

五、焊接与装配建议

  • 支持无铅回流焊,建议遵循厂商回流温度曲线(峰值温度 ≤ 260°C,具体以数据表为准)。
  • 装配时避免基板弯曲或局部应力,防止端电极或陶瓷体因机械应力产生裂纹。
  • 对静电敏感电路请做好 ESD 防护,避免在带电或高压环境下直接操作贴片。

六、包装与储存

  • 常用卷带(Tape & Reel)包装,便于 SMT 贴装机使用。
  • 储存环境建议干燥、常温,避免高温高湿和长期日晒;如有吸湿敏感建议按厂商建议回流前烘烤处理。

七、可靠性与品质保障

CCTC(三环)产品通过严格的工艺控制与出厂检测,适配工业级与商用级可靠性要求。具体的绝缘电阻、耐压测试值、温度循环与寿命测试请参阅产品数据表或向供应商索取完整检验报告,以便在关键应用中完成设计验证。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.